Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods and Design Practices (Asme Press Book Series on Electronic Packaging)

With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries

by Lian-tuu Yeh And Richard C. Chu

with An Increased Demand On System Reliability And Performance Combined With The Miniaturization Of Devices, Thermal Consideration Has Become A Crucial Factor In The Design Of Electronic Packaging, From Chip To System Levels.

this New Book Emphasizes The Solving Of Practical Design Problems In A Wide Range Of Subjects Related To Various Heat Transfer Technologies.

while Focusing On Understanding The Physics Involved In The Subject Area, The Authors Have Provided Substantial Practical Design Data And Empirical Correlations Used In The Analysis And Design Of Equipment.

the Book Provides The Fundamentals Along With A Step-by-step Analysis Approach To Engineering, Making It An Indispensable Reference Volume.

the Authors Present A Comprehensive Convective Heat Transfer Catalog That Includes Correlations Of Heat Transfer For Various Physical Configurations And Thermal Boundary Conditions.

they Also Provide Property Tables Of Solids And Fluids. Lian-tuu Yeh And Richard Chu Are Recognized Experts In The Field Of Thermal Management Of Electronic Systems And Have A Combined 60 Years Of Experience In The Defense And Commercial Industries.

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veteran Researchers Yeh And Chu (both Have Worked In The Field For Decades And Published Extensively) Describe The Factors Behind The Thermal Performance Of Electronics And Provide Details On The Wide Range Of Subjects And Solutions Necessary For Different Applications. The Physics Of Heat Transfer Is Described At Length, Including The Fundamentals Of Various Heat Transfer Modes And Thermal Interface Resistances. Appendices Provide Property Tables For Solids And 16 Types Of Fluids. This Text Will Be Useful For Advanced Undergraduate And Graduate Courses. Annotation C. Book News, Inc., Portland, Or

With this systematic examination of the factors that govern the thermal performance of electronics, the authors solve design problems encountered in developing and analysing very-high-performance and high-heat-dissipation devices, as well as intermediate and lower-power devices.