Справочник по электроустановкам промышленных предприятий. Монтаж электроустановок промышленных предприятий

VLSI Electronics: Microstructure Science, Volume 3 evaluates trends for the future of very large scale integration (VLSI) electronics and the scientific base that supports its development. This book discusses the impact of VLSI on computer architectures; VLSI design and design aid requirements; and design, fabrication, and performance of CCD imagers. The approaches, potential, and progress of ultra-high-speed GaAs VLSI; computer modeling of MOSFETs; and numerical physics of micron-length and submicron-length semiconductor devices are also elaborated. This text likewise covers the optical linewidth measurements on photomasks and wafers and effects of materials technology and fabrication tolerances on guided-wave optical communication and signal processing. This volume is recommended for scientists and engineers who wish to become familiar with VLSI electronics, device designers concerned with the fundamental character of and limitations to device performance, systems architects who will be charged with tying VLSI circuits together, and engineers conducting work on the utilization of VLSI circuits in specific areas of application. Application Specific Integrated Circuit (ASIC) Technology explores and discusses the different aspects of the ASIC technology experienced during the 1990s. The topics of the chapters range from the ASIC business, model, marketing, and development up to its testability, packaging, and quality and reliability. An introductory chapter begins the discussion and tackles the historical perspective and the classification of the ASIC technology. Chapters 2 and 3 cover the business side of the technology as it discusses the market dynamics and marketing strategies. The following chapters focus on the product itself and deal with the design and model and library development. Computer-aided design tools and systems are included in the discussion. Manufacturing and packaging of ASICs are also given attention in the book. Finally, the last three chapters present the application, testability, and reliability of ASIC technology. The text can be of most help to students in the fields of microelectronics, computer technology, and engineering. V. 1-5. [without Special Title] -- V. 6. Materials And Process Characterization -- V. 7. [without Special Title] -- V. 8. Plasma Processing For Vlsi -- V. 9. [without Special Title] -- V. 10. Surface And Interface Effects In Vlsi -- V. 11. Gaas Microelectronics -- V. 12. Silicon Materials -- V. 13. Metal-semiconductor Contacts And Devices -- V. 14. Vlsi Design -- V. 15. Vlsi Metallization -- V. 16. Lithography For Vlsi -- V. 17. Vlsi In Medicine -- V. 18. Advanced Mos Device Physics -- V. 19. Advanced Cmos Process Technology -- 20. Vlsi And Computer Architecture -- V. 21. Beam Processing Technologies -- V. 22. Vlsi Reliability -- V. 23. Application Specific Integrated Circuit (asic) Technology -- V. 24. Heterostructures And Quantum Devices. Edited By Norman G. Einspruch. Includes Bibliographical References And Index. v. 1-5. [without special titles] v. 6. Materials and process characterization v. 7. [without special title] v. 8. Plasma processing for VLSI v. 9. [without special title] v. 10. Surface and interface effects in VLSI v. 11. GaAs microelectronics v. 12. Silicon materials v. 13. Metal-semiconductor contacts and devices v. 14. VLSI design v. 15. VLSI metallization v. 16. Lithography for VLSI v. 17. VLSI in medicine v.18. Advanced MOS device physics 19. Advanced CMOS process technology v. 21. Beam processing technologies v. 22. VLSI reliability v. 23. Application specific integrated circuit (ASIC) technology v. 24. Heterostructures and quantum devices. Presents a survey of current developments in ASIC technology, addressed from the viewpoints of both ASIC vendor and user. Topics covered include ASIC business, marketing, design, CAD, manufacturing, and application and selection of ASICs.