کتابچه راهنمای کنترل حرارتی فضاپیما، جلد اول: فناوریهای بنیادی
Spacecraft Thermal Control Handbook, Volume I: Fundamental Technologies
معرفی کتاب «کتابچه راهنمای کنترل حرارتی فضاپیما، جلد اول: فناوریهای بنیادی» (با عنوان لاتین Spacecraft Thermal Control Handbook, Volume I: Fundamental Technologies) نوشتهٔ Mlodinow، Leonard و Gilmore, David G, D Gilmore, The Aerospace Corporation، منتشرشده توسط نشر AIAA (American Institute of Aeronautics & Astronautics) در سال 2002. این کتاب در فرمت pdf، زبان انگلیسی ارائه شده است.
This new edition of the classic Satellite Thermal Control Handbook, is a thorough, technical survey of the various technologies used to achieve thermal control of all types of spacecraft, as well as the design and analysis methods used by thermal engineers. Features: Spacecraft Systems Overview; Spacecraft Thermal Environments; Thermal Design Examples; Thermal Surface Finishes; Insulation; Radiators; Heaters; Mounting and Interfaces; Louvers; Heat Switches; Phase Change Materials; Pumped Fluid Loops; Thermoelectric Coolers; Heat Pipes; Thermal Design Analysis; Thermal Contact Resistance; Precision Temperature Control; Space Shuttle Integration; Thermal Testing; Future Technologies 8911X_fm[1] 1 Front Matter 1 Acknowledgements 4 Contributing Authors 5 Preface 3 Table of Contents -1 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_toc[1] 9 Front Matter -1 Preface -1 Table of Contents 9 1. Spacecraft Systems Overview -1 1.1 Introduction -1 1.2 Spacecraft Configurations -1 1.3 Earth Orbits -1 1.4 Interplanetary Orbits -1 1.5 Missions -1 2. Spacecraft Thermal Environments -1 2.1 Environments of Earth Orbit -1 2.2 Standard Earth Orbits -1 2.3 Environments of Interplanetary Missions -1 2.4 Aerobraking Environments -1 2.5 Launch and Ascent Environments -1 2.6 References -1 3. Thermal Design Examples -1 3.1 Introduction -1 3.2 Spin-Stabilized Satellites -1 3.3 Three-Axis-Stabilized Satellites -1 3.4 Propulsion Systems -1 3.5 Batteries -1 3.6 Antennas -1 3.7 Sun, Earth, and Star Sensors -1 3.8 Cooled Devices -1 3.9 Solar Arrays -1 3.10 The Huygens Probe -1 3.11 System Overview: The Hubble Space Telescope -1 4. Thermal Surface Finishes -1 4.1 Introduction -1 4.2 Common Thermal Surface Finishes -1 4.3 Causes of Thermal Surface Degradation -1 4.4 Degradation Rates for Common Thermal Finishes -1 4.5 LDEF Results -1 4.6 Electrical Grounding -1 4.7 References -1 5. Insulation -1 5.1 Introduction -1 5.2 Blanket Performance -1 5.3 Blanket Design Requirements -1 5.4 Materials -1 5.5 Provisions for Venting -1 5.6 Attachments -1 5.7 Provisions for Electrical Grounding -1 5.8 Fabrication -1 5.9 Bakeout and Cleaning -1 5.10 High-Temperature Blankets -1 5.11 Suggestions -1 5.12 Insulation for In-Atmosphere Applications -1 5.13 References -1 6. Radiators -1 6.1 Introduction -1 6.2 Passive Structure Radiators -1 6.3 Structural Panels with Heat Pipes -1 6.4 Body-Mounted Radiators -1 6.5 Deployable Radiators -1 6.6 Radiator Freezing -1 6.7 Radiator Effectiveness -1 6.8 Experimental Radiators -1 6.9 References -1 7. Heaters -1 7.1 Introduction -1 7.2 Heater Types -1 7.3 Control -1 7.4 Failure Modes of Mechanical Thermostats -1 7.5 Circuits -1 7.6 Computer-Controlled Heater System Example -1 7.7 Radioisotope Heater Units -1 8. Mountings and Interfaces -1 8.1 Introduction -1 8.2 Unit Conduction Cooling -1 8.3 Bolted-Joint Conductance without Interface Filler -1 8.4 Bolted-Joint Conductance with Interface Filler -1 8.5 Complex Configurations and Special Topics -1 8.6 Nomenclature -1 8.7 References -1 9. Louvers -1 9.1 Introduction -1 9.2 Vane Louvers -1 9.3 Analysis of Vane Louvers -1 9.4 Designing Louvers for Operation in Sunlight -1 9.5 Pinwheel Louvers -1 9.6 References -1 10. Heat Switches -1 10.1 Introduction -1 10.2 Heat-Switch Applications -1 10.3 Heat-Switch Integration -1 10.4 Paraffin Heat Switches -1 10.5 Cryogenic Heat Switches -1 10.6 References -1 11. Phase-Change Materials -1 11.1 Phase-Change-Material Applications -1 11.2 Phase-Change Materials -1 11.3 When To Use a PCM -1 11.4 PCM Design Details -1 11.5 The PCM Design Process -1 11.6 References -1 12. Pumped Fluid Loops -1 12.1 Introduction -1 12.2 Fluid-Flow Concepts and Basic Equations -1 12.3 Forced Convection in Pipes and Tubes -1 12.4 System Hardware -1 12.5 Analysis of a Fluid Loop -1 12.6 Computer Software for System Analysis -1 12.7 PFL Application -1 12.8 References -1 13. Thermoelectric Coolers -1 13.1 Introduction -1 13.2 Background -1 13.3 Characteristics -1 13.4 Optimizations -1 13.5 Heat Load Testing -1 13.6 Interfaces -1 13.7 XRT Focal-Plane TEC Mounting -1 13.8 Design Development -1 13.9 Power Supply -1 13.10 Application Example -1 13.11 Reference -1 14. Heat Pipes -1 14.1 Overview -1 14.2 Types of Heat Pipe -1 14.3 Analysis -1 14.4 Testing -1 14.5 Heat-Pipe Applications and Performance -1 14.6 Heat-Pipe References -1 14.7 LHPs and CPLs -1 14.8 Selecting a Design -1 14.9 References -1 15. Thermal Design Analysis -1 15.1 Introduction -1 15.2 Spacecraft Project Phases -1 15.3 Thermal Design/Analysis Process Overview -1 15.4 Fundamentals of Thermal Modeling -1 15.5 Thermal Design Analysis Example: POAM -1 15.6 Margins -1 15.7 TMM Computer Codes -1 15.8 Radiation Analysis Codes -1 15.9 References -1 16. Thermal Contact Resistance -1 16.1 Introduction -1 16.2 Contact Heat-Transfer Background -1 16.3 Parameters Influencing Thermal Joint Resistance -1 16.4 Thermal Joint Resistance Models -1 16.5 The Effect of Oxidation on Thermal Contact Resistance -1 16.6 The Effect of Interstitial Materials on Thermal Contact Resistance -1 16.7 References -1 17. Precision Temperature Control -1 17.1 Introduction -1 17.2 The Space Interferometry Mission -1 17.3 The Hydrogen Maser Clock -1 17.4 Summary -1 17.5 References -1 18. Space Shuttle Integration -1 18.1 Introduction -1 18.2 Engineering-Compatibility Assessment -1 18.3 Safety Assessment -1 18.4 The Cargo Integration Review -1 18.5 Orbiter Payload-Bay Thermal Environment -1 18.6 Middeck Payload Accommodations -1 18.7 Ferry-Flight Accommodations -1 18.8 Optional Services -1 19. Thermal Testing -1 19.1 Introduction -1 19.2 Definitions -1 19.3 Design Environments -1 19.4 Development Thermal Testing -1 19.5 Unit Thermal Testing -1 19.6 Subsystem and Payload Thermal Testing -1 19.7 System Thermal Testing -1 19.8 Launch Site Thermal Testing -1 19.9 References -1 20. Technology Projections -1 20.1 Introduction -1 20.2 Technology Drivers -1 20.3 Programmatic Concerns -1 20.4 Future Technologies and Innovations -1 20.5 Summary -1 20.6 References -1 Appendix A: Surface Optical Property Data -1 Appendix B: Material Thermal Properties -1 Appendix C: Thermally Conductive Filler Materials and Suppliers -1 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_01[1] 14 Front Matter -1 Table of Contents -1 1. Spacecraft Systems Overview 14 1.1 Introduction 14 1.2 Spacecraft Configurations 14 1.3 Earth Orbits 20 1.4 Interplanetary Orbits 24 1.5 Missions 28 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_02[1] 34 Front Matter -1 Table of Contents -1 2. Spacecraft Thermal Environments 34 2.1 Environments of Earth Orbit 34 2.2 Standard Earth Orbits 49 2.3 Environments of Interplanetary Missions 61 2.4 Aerobraking Environments 73 2.5 Launch and Ascent Environments 76 2.6 References 80 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_03[1] 83 Front Matter -1 Table of Contents -1 3. Thermal Design Examples 83 3.1 Introduction 83 3.2 Spin-Stabilized Satellites 83 3.3 Three-Axis-Stabilized Satellites 84 3.4 Propulsion Systems 85 3.5 Batteries 89 3.6 Antennas 91 3.7 Sun, Earth, and Star Sensors 93 3.8 Cooled Devices 96 3.9 Solar Arrays 98 3.10 The Huygens Probe 99 3.11 System Overview: The Hubble Space Telescope 107 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_04[1] 150 Front Matter -1 Table of Contents -1 4. Thermal Surface Finishes 150 4.1 Introduction 150 4.2 Common Thermal Surface Finishes 150 4.3 Causes of Thermal Surface Degradation 154 4.4 Degradation Rates for Common Thermal Finishes 163 4.5 LDEF Results 166 4.6 Electrical Grounding 169 4.7 References 170 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_05[1] 171 Front Matter -1 Table of Contents -1 5. Insulation 171 5.1 Introduction 171 5.2 Blanket Performance 172 5.3 Blanket Design Requirements 179 5.4 Materials 179 5.5 Provisions for Venting 192 5.6 Attachments 193 5.7 Provisions for Electrical Grounding 196 5.8 Fabrication 197 5.9 Bakeout and Cleaning 203 5.10 High-Temperature Blankets 203 5.11 Suggestions 204 5.12 Insulation for In-Atmosphere Applications 208 5.13 References 215 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_06[1] 216 Front Matter -1 Table of Contents -1 6. Radiators 216 6.1 Introduction 216 6.2 Passive Structure Radiators 218 6.3 Structural Panels with Heat Pipes 218 6.4 Body-Mounted Radiators 218 6.5 Deployable Radiators 220 6.6 Radiator Freezing 224 6.7 Radiator Effectiveness 226 6.8 Experimental Radiators 229 6.9 References 231 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_07[1] 232 Front Matter -1 Table of Contents -1 7. Heaters 232 7.1 Introduction 232 7.2 Heater Types 232 7.3 Control 233 7.4 Failure Modes of Mechanical Thermostats 236 7.5 Circuits 237 7.6 Computer-Controlled Heater System Example 240 7.7 Radioisotope Heater Units 250 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_08[1] 255 Front Matter -1 Table of Contents -1 8. Mountings and Interfaces 255 8.1 Introduction 255 8.2 Unit Conduction Cooling 255 8.3 Bolted-Joint Conductance without Interface Filler 268 8.4 Bolted-Joint Conductance with Interface Filler 283 8.5 Complex Configurations and Special Topics 292 8.6 Nomenclature 328 8.7 References 331 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_09[1] 338 Front Matter -1 Table of Contents -1 9. Louvers 338 9.1 Introduction 338 9.2 Vane Louvers 339 9.3 Analysis of Vane Louvers 342 9.4 Designing Louvers for Operation in Sunlight 353 9.5 Pinwheel Louvers 356 9.6 References 359 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_10[1] 360 Front Matter -1 Table of Contents -1 10. Heat Switches 360 10.1 Introduction 360 10.2 Heat-Switch Applications 361 10.3 Heat-Switch Integration 362 10.4 Paraffin Heat Switches 364 10.5 Cryogenic Heat Switches 373 10.6 References 377 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_11[1] 379 Front Matter -1 Table of Contents -1 11. Phase-Change Materials 379 11.1 Phase-Change-Material Applications 379 11.2 Phase-Change Materials 383 11.3 When To Use a PCM 386 11.4 PCM Design Details 389 11.5 The PCM Design Process 408 11.6 References 408 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_12[1] 410 Front Matter -1 Table of Contents -1 12. Pumped Fluid Loops 410 12.1 Introduction 410 12.2 Fluid-Flow Concepts and Basic Equations 412 12.3 Forced Convection in Pipes and Tubes 420 12.4 System Hardware 423 12.5 Analysis of a Fluid Loop 447 12.6 Computer Software for System Analysis 448 12.7 PFL Application 449 12.8 References 473 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_13[1] 478 Front Matter -1 Table of Contents -1 13. Thermoelectric Coolers 478 13.1 Introduction 478 13.2 Background 478 13.3 Characteristics 480 13.4 Optimizations 481 13.5 Heat Load Testing 483 13.6 Interfaces 483 13.7 XRT Focal-Plane TEC Mounting 484 13.8 Design Development 485 13.9 Power Supply 486 13.10 Application Example 486 13.11 Reference 492 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_14[1] 493 Front Matter -1 Table of Contents -1 14. Heat Pipes 493 14.1 Overview 493 14.2 Types of Heat Pipe 494 14.3 Analysis 500 14.4 Testing 504 14.5 Heat-Pipe Applications and Performance 505 14.6 Heat-Pipe References 506 14.7 LHPs and CPLs 506 14.8 Selecting a Design 522 14.9 References 525 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_15[1] 527 Front Matter -1 Table of Contents -1 15. Thermal Design Analysis 527 15.1 Introduction 527 15.2 Spacecraft Project Phases 527 15.3 Thermal Design/Analysis Process Overview 538 15.4 Fundamentals of Thermal Modeling 541 15.5 Thermal Design Analysis Example: POAM 556 15.6 Margins 576 15.7 TMM Computer Codes 579 15.8 Radiation Analysis Codes 596 15.9 References 601 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_16[1] 603 Front Matter -1 Table of Contents -1 16. Thermal Contact Resistance 603 16.1 Introduction 603 16.2 Contact Heat-Transfer Background 604 16.3 Parameters Influencing Thermal Joint Resistance 606 16.4 Thermal Joint Resistance Models 607 16.5 The Effect of Oxidation on Thermal Contact Resistance 627 16.6 The Effect of Interstitial Materials on Thermal Contact Resistance 630 16.7 References 640 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_17[1] 643 Front Matter -1 Table of Contents -1 17. Precision Temperature Control 643 17.1 Introduction 643 17.2 The Space Interferometry Mission 644 17.3 The Hydrogen Maser Clock 659 17.4 Summary 670 17.5 References 670 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_18[1] 671 Front Matter -1 Table of Contents -1 18. Space Shuttle Integration 671 18.1 Introduction 671 18.2 Engineering-Compatibility Assessment 673 18.3 Safety Assessment 679 18.4 The Cargo Integration Review 680 18.5 Orbiter Payload-Bay Thermal Environment 681 18.6 Middeck Payload Accommodations 701 18.7 Ferry-Flight Accommodations 704 18.8 Optional Services 705 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_19[1] 713 Front Matter -1 Table of Contents -1 19. Thermal Testing 713 19.1 Introduction 713 19.2 Definitions 714 19.3 Design Environments 719 19.4 Development Thermal Testing 729 19.5 Unit Thermal Testing 731 19.6 Subsystem and Payload Thermal Testing 746 19.7 System Thermal Testing 746 19.8 Launch Site Thermal Testing 760 19.9 References 761 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_20[1] 762 Front Matter -1 Table of Contents -1 20. Technology Projections 762 20.1 Introduction 762 20.2 Technology Drivers 763 20.3 Programmatic Concerns 764 20.4 Future Technologies and Innovations 764 20.5 Summary 789 20.6 References 790 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_app[1] 793 Front Matter -1 Table of Contents -1 Appendix A: Surface Optical Property Data 793 Appendix B: Material Thermal Properties 804 Appendix C: Thermally Conductive Filler Materials and Suppliers 820 Index -1 A -1 B -1 C -1 D -1 E -1 F -1 G -1 H -1 I -1 J -1 K -1 L -1 M -1 N -1 O -1 P -1 Q -1 R -1 S -1 T -1 U -1 V -1 W -1 8911X_indx[1] 831 Front Matter -1 Table of Contents -1 Index 831 A 831 B 831 C 831 D 832 E 832 F 832 G 832 H 832 I 833 J 833 K 833 L 833 M 833 N 834 O 834 P 834 Q 834 R 834 S 834 T 835 U 836 V 836 W 836 Front Matter......Page 1 Acknowledgements......Page 4 Contributing Authors......Page 5 Preface......Page 3 Table of Contents......Page 0 Table of Contents......Page 9 1.2 Spacecraft Configurations......Page 14 1.3 Earth Orbits......Page 20 1.4 Interplanetary Orbits......Page 24 1.5 Missions......Page 28 2.1 Environments of Earth Orbit......Page 34 2.2 Standard Earth Orbits......Page 49 2.3 Environments of Interplanetary Missions......Page 61 2.4 Aerobraking Environments......Page 73 2.5 Launch and Ascent Environments......Page 76 2.6 References......Page 80 3.2 Spin-Stabilized Satellites......Page 83 3.3 Three-Axis-Stabilized Satellites......Page 84 3.4 Propulsion Systems......Page 85 3.5 Batteries......Page 89 3.6 Antennas......Page 91 3.7 Sun, Earth, and Star Sensors......Page 93 3.8 Cooled Devices......Page 96 3.9 Solar Arrays......Page 98 3.10 The Huygens Probe......Page 99 3.11 System Overview: The Hubble Space Telescope......Page 107 4.2 Common Thermal Surface Finishes......Page 150 4.3 Causes of Thermal Surface Degradation......Page 154 4.4 Degradation Rates for Common Thermal Finishes......Page 163 4.5 LDEF Results......Page 166 4.6 Electrical Grounding......Page 169 4.7 References......Page 170 5.1 Introduction......Page 171 5.2 Blanket Performance......Page 172 5.4 Materials......Page 179 5.5 Provisions for Venting......Page 192 5.6 Attachments......Page 193 5.7 Provisions for Electrical Grounding......Page 196 5.8 Fabrication......Page 197 5.10 High-Temperature Blankets......Page 203 5.11 Suggestions......Page 204 5.12 Insulation for In-Atmosphere Applications......Page 208 5.13 References......Page 215 6.1 Introduction......Page 216 6.4 Body-Mounted Radiators......Page 218 6.5 Deployable Radiators......Page 220 6.6 Radiator Freezing......Page 224 6.7 Radiator Effectiveness......Page 226 6.8 Experimental Radiators......Page 229 6.9 References......Page 231 7.2 Heater Types......Page 232 7.3 Control......Page 233 7.4 Failure Modes of Mechanical Thermostats......Page 236 7.5 Circuits......Page 237 7.6 Computer-Controlled Heater System Example......Page 240 7.7 Radioisotope Heater Units......Page 250 8.2 Unit Conduction Cooling......Page 255 8.3 Bolted-Joint Conductance without Interface Filler......Page 268 8.4 Bolted-Joint Conductance with Interface Filler......Page 283 8.5 Complex Configurations and Special Topics......Page 292 8.6 Nomenclature......Page 328 8.7 References......Page 331 9.1 Introduction......Page 338 9.2 Vane Louvers......Page 339 9.3 Analysis of Vane Louvers......Page 342 9.4 Designing Louvers for Operation in Sunlight......Page 353 9.5 Pinwheel Louvers......Page 356 9.6 References......Page 359 10.1 Introduction......Page 360 10.2 Heat-Switch Applications......Page 361 10.3 Heat-Switch Integration......Page 362 10.4 Paraffin Heat Switches......Page 364 10.5 Cryogenic Heat Switches......Page 373 10.6 References......Page 377 11.1 Phase-Change-Material Applications......Page 379 11.2 Phase-Change Materials......Page 383 11.3 When To Use a PCM......Page 386 11.4 PCM Design Details......Page 389 11.6 References......Page 408 12.1 Introduction......Page 410 12.2 Fluid-Flow Concepts and Basic Equations......Page 412 12.3 Forced Convection in Pipes and Tubes......Page 420 12.4 System Hardware......Page 423 12.5 Analysis of a Fluid Loop......Page 447 12.6 Computer Software for System Analysis......Page 448 12.7 PFL Application......Page 449 12.8 References......Page 473 13.2 Background......Page 478 13.3 Characteristics......Page 480 13.4 Optimizations......Page 481 13.6 Interfaces......Page 483 13.7 XRT Focal-Plane TEC Mounting......Page 484 13.8 Design Development......Page 485 13.10 Application Example......Page 486 13.11 Reference......Page 492 14.1 Overview......Page 493 14.2 Types of Heat Pipe......Page 494 14.3 Analysis......Page 500 14.4 Testing......Page 504 14.5 Heat-Pipe Applications and Performance......Page 505 14.7 LHPs and CPLs......Page 506 14.8 Selecting a Design......Page 522 14.9 References......Page 525 15.2 Spacecraft Project Phases......Page 527 15.3 Thermal Design/Analysis Process Overview......Page 538 15.4 Fundamentals of Thermal Modeling......Page 541 15.5 Thermal Design Analysis Example: POAM......Page 556 15.6 Margins......Page 576 15.7 TMM Computer Codes......Page 579 15.8 Radiation Analysis Codes......Page 596 15.9 References......Page 601 16.1 Introduction......Page 603 16.2 Contact Heat-Transfer Background......Page 604 16.3 Parameters Influencing Thermal Joint Resistance......Page 606 16.4 Thermal Joint Resistance Models......Page 607 16.5 The Effect of Oxidation on Thermal Contact Resistance......Page 627 16.6 The Effect of Interstitial Materials on Thermal Contact Resistance......Page 630 16.7 References......Page 640 17.1 Introduction......Page 643 17.2 The Space Interferometry Mission......Page 644 17.3 The Hydrogen Maser Clock......Page 659 17.5 References......Page 670 18.1 Introduction......Page 671 18.2 Engineering-Compatibility Assessment......Page 673 18.3 Safety Assessment......Page 679 18.4 The Cargo Integration Review......Page 680 18.5 Orbiter Payload-Bay Thermal Environment......Page 681 18.6 Middeck Payload Accommodations......Page 701 18.7 Ferry-Flight Accommodations......Page 704 18.8 Optional Services......Page 705 19.1 Introduction......Page 713 19.2 Definitions......Page 714 19.3 Design Environments......Page 719 19.4 Development Thermal Testing......Page 729 19.5 Unit Thermal Testing......Page 731 19.7 System Thermal Testing......Page 746 19.8 Launch Site Thermal Testing......Page 760 19.9 References......Page 761 20.1 Introduction......Page 762 20.2 Technology Drivers......Page 763 20.4 Future Technologies and Innovations......Page 764 20.5 Summary......Page 789 20.6 References......Page 790 Appendix A: Surface Optical Property Data......Page 793 Appendix B: Material Thermal Properties......Page 804 Appendix C: Thermally Conductive Filler Materials and Suppliers......Page 820 C......Page 831 H......Page 832 M......Page 833 S......Page 834 T......Page 835 W......Page 836 Annotation This Is A Revised And Updated Of (1994) And Has Been Expanded To Discuss Interplanetary Spacecraft As Well As Earth- Orbiting Satellites. The Work Is Presented As A Compendium Of Corporate Knowledge In The Field Of Thermal Control Of Uncrewed Spacecraft And Was Written For Thermal Engineers Of A Range Of Experience Levels. After Discussing General Issues And Historical Design Approaches Chapters Examine Current Thermal Control Hardware, The Thermal Design And Testing Process, And Emerging Thermal Technologies. Annotation C. Book News, Inc., Portland, Or (booknews.com). Annotation This Practical Handbook Provides The Reader With Enough Background And Specific Information To Begin Conducting Thermal Analysis And To Participate In The Thermal Design Of Spacecraft Systems. The Book Is A Revised And Updated Edition Of Satellite Thermal Control Handbook, Published In 1994. The Name Change Reflects The Expanded Scope Of This Work, Which Now Includes Thermal Environments And Design Techniques For Interplanetary Spacecraft, In Addition To The Earth-orbiting Satellites That Were The Focus Of The Original Handbook. The Reader Will Now Find An Updated Characterization Of The Thermal Environment In Earth Orbit, New Material Documenting The Environments Of Interplanetary Missions, More Detailed Information About Each Of The Thermal Control Hardware Elements Found In The First Edition, And Presentation Of Some Newer Technologies Such As Heat Switches And Precision Temperature Control Techniques. V. 1. Fundamental Technologies--v. 2. Cryogenics. David G. Gilmore, Editor. Includes Bibliographical References And Index.
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