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Solid Circuits and Microminiaturization : Proceedings of the Conference Held at West Ham College of Technology, June, 1963.

معرفی کتاب «Solid Circuits and Microminiaturization : Proceedings of the Conference Held at West Ham College of Technology, June, 1963.» نوشتهٔ G. W. A., Editor Dummer، منتشرشده توسط نشر Elsevier Ltd در سال 1964. این کتاب در فرمت pdf، زبان انگلیسی ارائه شده است.

Solid Circuits and Microminiaturization is a collection of the proceedings of the Conference on Solid Circuits and Microminiaturization held at West Ham College of Technology in the UK in June 1963. The conference provided a forum for discussing trends in the microminiaturization of solid circuits and covered a wide range of topics related to the subject, including the design and manufacture of solid circuits; solid circuit fabrication techniques and the resulting passive component characteristics; and equipment design philosophy using integrated circuits. This book is comprised of 27 chapters and begins with an overview of the status and trends in microminiaturization, followed by a description of the techniques used to fabricate solid state circuits and a comparison of the properties of various types of solid state circuits. Subsequent chapters focus on the approaches used in the design and manufacture of solid circuits; characteristics and application of micrologic elements; techniques for the use of solid circuits together with conventional components in miniaturized assemblies; and the application of solid state circuits to computer design. High-speed integrated digital circuits and a group of integrated circuits for linear amplification are also described. This monograph will be of particular value to electronics engineers and systems designers. Content: Inside Front Cover, Page ii Front Matter, Page iii Copyright, Page iv LIST OF DELEGATES, Pages 1-13 OPENING ADDRESS TO THE CONFERENCE, Pages 15-16, G.W.A. Dummer 1.1 - STATUS AND TRENDS IN MICROMINIATURIZATION, Pages 17-21, J.S. Walker 1.2 - SOLID STATE CIRCUIT TECHNOLOGY, Pages 23-36, C.P. Sandbank 1.3 - THE DESIGN AND MANUFACTURE OF SOLID CIRCUITS: With special reference to Micrologic, Pages 37-40, J.T. Kendall 1.4 - CURRENT DEVELOPMENTS IN MICROMINIATURIZATION AT SESCO-MCP, Pages 41-61, A. Bobenrieth DISCUSSION, Pages 62-66 2.1 - THE SCOPE OF THE SOLID CIRCUIT CIRCUIT DESIGNER, Pages 67-73, R.W.A. Scarr 2.2 - SOLID CIRCUIT FABRICATION TECHNIQUES AND THE RESULTING PASSIVE COMPONENT CHARACTERISTICS, Pages 75-80, B.L.H. Wilson 2.3 - CHARACTERISTICS AND APPLICATIONS OF MICROLOGIC ELEMENTS, Pages 81-101, P.J. Bénéteau, S. Iannazzo DISCUSSION, Pages 102-105 3.1 - EQUIPMENT DESIGN PHILOSOPHY USING INTEGRATED CIRCUITS, Pages 107-111, P.R. Thomas 3.2 - TECHNIQUES FOR THE USE OF SOLID CIRCUITS TOGETHER WITH CONVENTIONAL COMPONENTS IN MINIATURISED ASSEMBLIES, Pages 113-123, E.F. Grube, D. Popplewell, J.L. Storr-Best 3.3 - A TUNABLE SOLID-CIRCUIT FILTER FOR USE IN AN I.F. AMPLIFIER, Pages 125-132, T.E. Price 3.4 - A PUNCHED-TAPE COMPARATOR USING INTEGRATED CIRCUITS, Pages 133-141, P.D. Forte 3.5 - AN EQUIPMENT MAKER'S VIEWS ON SOME MICROMINIATURE SYSTEMS, Pages 143-158, A.T. Lawton DISCUSSION, Pages 159-165 4.1 - CHARACTERISTICS OF A SERIES OF COMPATIBLE DIGITAL LOGIC NETWORKS, Pages 167-174, J.A. Cayzer 4.2 - THE APPLICATION OF SOLID STATE CIRCUITS TO COMPUTER DESIGN, Pages 175-179, M.W. Gribble 4.3 - SOLID CIRCUIT LOGIC ELEMENTS USING MULTIPLE EMITTER TRANSISTORS, Pages 181-188, B.A. Boulter 4.4 - HIGH SPEED INTEGRATED DIGITAL CIRCUITS, Pages 189-201, R.S. Dunn 5.1 - A GROUP OF INTEGRATED CIRCUITS FOR LINEAR AMPLIFICATION, Pages 203-214, K. Gurnett, A. Bardsley 5.2 - A SOLID CIRCUIT AMPLIFIER, Pages 215-220, W. Holt 5.3 - INTEGRATED TUNNEL DIODE CIRCUITS, Pages 221-230, C.P. Sandbank DISCUSSION, Pages 231-237 5.4 - DESIGN OF AN EXPERIMENTAL ELECTRON BEAM MACHINING APPARATUS, Pages 239-255, P.A. Einstein 5.5 - ELECTRON BEAM ETCHING IN MICROMINIATURISATION, Pages 257-269, W.C. Nixon 6.1 - PREPARATION OF SILICON DEVICE MATRICES FOR SOLID CIRCUITS, Pages 271-277, E.G. Sandifer 6.2 - CHARACTERISTICS AND APPLICATIONS OF SOLID CIRCUITS FROM SILICON DEVICE MATRICES, Pages 279-284, J.A. Chandler 6.3 - THE ROLE OF THIN FILM CIRCUITS IN MICROMINIATURIZATION, Pages 285-299, E.E. Smith 7.1 - WHY MAKE CIRCUITS SOLID ?, Pages 301-307, D.H. Roberts 7.2 - A COMPARISON OF THE MICROELECTRONIC SYSTEMS, Pages 309-319, J.W. Granville DISCUSSION, Pages 320-333 APPENDIX 1 - THE SUITABILITY OF SOLID CIRCUITS FOR USE IN COMMERCIAL DIGITAL COMPUTERS, Pages 335-339, G.C. Rowley INDEX - SUBJECTS, Pages 340-343 INDEX - AUTHORS AND DISCUSSION PARTICIPANTS, Pages 344-346
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