Semiconductor Manufacturing Technology

In this book, Quirk and Serda introduce the terminology, concepts, processes, products, and equipment commonly used in the manufacture of ultra large scale integrated (ULSI) semiconductors. The book provides helpful, up-to-date technical information about semiconductor manufacturing and strikes an effective balance between the process and equipment technology found in wafer fabrications. Topics include copper interconnect; dual damascene additive process for metallization; deep UV sub-micron photolithography (.18 micron and below); low-k dielectric processing; chemical mechanical planarization; a comprehensive model of manufacturing process; chemical-mechanical polish (CMP); and maintenance and troubleshooting. For practicing semiconductor manufacturing technicians or those interested in semiconductor manufacturing technology and processes.

This book is written for students in two- and four-year technology programs at community colleges and universities. Chapters are organized around the broad technologies applicable to semiconductor manufacturing.

Chapters 1 to 8 present fundamental technical information relevant to semiconductor manufacturing. Chapter 9 presents a process model overview with a general flowchart that links the major areas in wafer fabrication. Chapters 10 to 19 cover each of the major processes. Each process chapter concludes with a summary of quality measures and troubleshooting issues to provide the student with practical challenges encountered during wafer fabrication. Chapter 20 provides an overview of the back-end process for IC assembly and packaging.

Academic and industry reviewers have applauded this book as the most comprehensive and up-to-date text currently available in the market.

In this book, Quirk and Serda introduce the terminology, concepts, processes, products, and equipment commonly used in the manufacture of ultra large scale integrated (ULSI) semiconductors. The book provides helpful, up-to-date technical information about semiconductor manufacturing and strikes an effective balance between the process and equipment technology found in wafer fabrications. Topics include copper interconnect; dual damascene additive process for metallization; deep __UV__ sub-micron photolithography (.18 micron and below); low-k dielectric processing; chemical mechanical planarization; a comprehensive model of manufacturing process; chemical-mechanical polish (CMP); and maintenance and troubleshooting. For practicing semiconductor manufacturing technicians or those interested in semiconductor manufacturing technology and processes.