Self-Organized 3D Integrated Optical Interconnects With All-Photolithographic Heterogeneous Integration : With All-Photolithographic Heterogeneous Integration

Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects. Cover Half Title Title Page Copyright Page Dedication Table of Contents Preface Chapter 1: Introduction Chapter 2: Guidelines toward Self-Organized 3D Integrated Optical Interconnects 2.1: Advantages of Lightwave Implementation into Boxes of Computers 2.2: Integrated Optical Interconnects 2.3: Self-Organization of 3D Integrated Optical Interconnects 2.4: E-O and O-E Signal Conversion in Integrated Optical Interconnects 2.5: Core Technologies for Self-Organized 3D Integrated Optical Interconnects Chapter 3: Scalable Film Optical Link Modules 3.1: Concept of S-FOLM 3.2: 3D Integrated Optical Interconnects Built by S-FOLMs 3.2.1: 3D OE Platforms 3.2.2: Structures within Boxes of Computers 3.3: Various OE Structures Built by S-FOLMs 3.3.1: OE-Film/Electrical Substrate Stack 3.3.2: OE-Film/OE-Film Stack and Backside Connection 3.3.3: Both-Side Mounting 3.3.4: Micro Optical Link Module 3.3.5: OE Tap Guide 3.3.6: WDM Transceiver and WDM Inter-PCB Connect 3.3.7: 3D Optical Circuits for WDM 3.4: Optoelectronic Amplifier/Driver-Less Substrate 3.4.1: Concept of OE-ADLES 3.4.2: Power Dissipation and RC Delay in OE-ADLES Chapter 4: Optical Waveguide Films with Vertical Mirrors and 3D Optical Circuits 4.1: Built-In Mask Method 4.2: Fabrication of Optical Waveguides and Vertical Mirrors 4.2.1: Waveguide Cores 4.2.2: Vertical Mirrors 4.3: Vertical Mirrors with Multi-Core-Layer Skirt-Type Structures 4.3.1: Observation of Beam Leakage and Scattering at Vertical Mirrors 4.3.2: Three-Core-Layer Skirt-Type Vertical Mirrors 4.3.3: Simulations of Beam Leakage/Scattering at Vertical Mirrors 4.3.4: Fabrication of Multi-Core-Layer Skirt-Type Vertical Mirrors 4.4: 3D Optical Circuits 4.4.1: Structures 4.4.2: Type I: Stacked Waveguide Films with Vertical Mirrors 4.4.2.1: Demonstration of 3D optical wiring 4.4.2.2: Loss measurements 4.4.2.3: Loss at Optical Z-Connection 4.4.3: Type II: Waveguide Films with Vertical Waveguides 4.5: Optical Waveguide Films Stacked on Electrical Boards 4.5.1: Process Flow 4.5.2: Waveguide-Film Stacking on PCBs 4.6: Nanoscale Waveguides Made of PRI Sol–Gel Thin Films 4.6.1: Linear, Bending, and Branching Waveguides 4.6.1.1: Fabrication processes 4.6.1.2: Linear waveguides 4.6.1.3: Bending and branching waveguides 4.6.2: Vertical Mirrors and All-Air-Cladding Waveguides Chapter 5: Resource-Saving All-Photolithographic Heterogeneous Integration: PL-Pack with SORT 5.1: Advantages of PL-Pack with SORT over Conventional Packaging 5.2: PL-Pack with SORT 5.2.1: Whole Process Flow of PL-Pack with SORT 5.2.2: Process Flow of SORT 5.3: Impacts of PL-Pack with SORT 5.3.1: Material Consumption and Costs 5.3.2: Mechanical Properties 5.3.3: Transfer Step Count 5.3.4: Small/Thin-Die Placement Density 5.4: SORT of Polymer Waveguide Lenses 5.5: SORT of Waveguide Cores 5.5.1: SORT Process for Optical Waveguides 5.5.2: Experimental Demonstration of SORT for Optical Waveguides 5.6: Light-Assisted SORT 5.6.1: LA-SORT 5.6.2: Experimental Demonstration of LA-SORT 5.7: SORT for Nanoscale Heterogeneous Integration Chapter 6: High-Speed/Small-Size Light Modulators and Optical Switches 6.1: Classification of Light Modulators and Optical Switches 6.2: Variable Well Optical ICs and Waveguide Prism Deflectors 6.3: Design and Predicted Performance of WPDs 6.3.1: EO Materials for WPDs 6.3.2: Model for 2 × 2 WPD Optical Switch 6.3.2.1: Preliminary model 6.3.2.2: Optimized model for performance evaluation 6.3.3: Predicted Performance 6.4: Advanced WPDs 6.4.1: WPD Optical Switches with ADD Functions 6.4.2: WPD Optical Switches with MUX/DEMUX Functions 6.5: Transient Responses in Microring Resonators and Photonic Crystals Chapter 7: Self-Organized Lightwave Networks 7.1: Concept of SOLNETs 7.1.1: Types of SOLNETs 7.1.2: PRI Materials 7.1.3: One-Photon and Two-Photon SOLNETs 7.1.4: Fabrication Processes of Luminescent Targets and Luminescent Regions 7.2: Performance of SOLNETs Predicted by Computer Simulations 7.2.1: Simulation Models 7.2.2: Simulation Procedures 7.2.3: SOLNETs between Nanoscale Waveguides 7.2.3.1: TB-SOLNET/P-SOLNET 7.2.3.2: R-SOLNET 7.2.3.3: LA-SOLNET 7.2.3.4: Performance of couplings 7.2.4: SOLNETs between Microscale and Nanoscale Waveguides 7.2.4.1: TB-SOLNET/P-SOLNET 7.2.4.2: R-SOLNET 7.2.4.3: LA-SOLNET 7.2.4.4: Performance of couplings 7.3: Experimental Demonstrations of One-Photon SOLNETs 7.3.1: One-Photon TB-SOLNETs 7.3.2: One-Photon R-SOLNETs with Micromirrors Formed by Free-Space Write Beams 7.3.3: One-Photon R-SOLNETs with Micromirrors 7.3.4: One-Photon R-SOLNETs with Reflective Objects 7.3.5: One-Photon R-SOLNETs with Luminescent Targets 7.3.5.1: Coumarin 481 luminescent targets 7.3.5.2: Alq3 luminescent targets 7.4: Experimental Demonstrations of Two-Photon SOLNETs 7.4.1: Two-Photon TB-SOLNETs 7.4.2: Two-Photon R-SOLNETs Chapter 8: Self-Organized 3D Integrated Optical Interconnects: Model Proposals 8.1: 3D Integrated Optical Interconnects with P- and R-SOLNETs 8.2: 3D Integrated Optical Interconnects with LA- and R-SOLNETs Chapter 9: Self-Organized 3D Micro Optical Switching Systems: Model Proposals and Predicted Performance 9.1: Advantages of 3D-MOSS 9.2: Architecture of 3D-MOSS 9.2.1: 3D-MOSS 9.2.2: 3D-MOSS with SOLNET Implementation 9.3: Predicted Performance of 1024 × 1024 3D-MOSS 9.3.1: Structural Model 9.3.2: Insertion Loss 9.3.3: Electrical Characteristics 9.3.4: Impact of HIC Waveguide Implementation into 3D-MOSS Chapter 10: Film-Based Integrated Solar Energy Conversion Systems 10.1: Integrated Solar Films 10.2: Waveguide-Type Thin-Film Solar Cells 10.3: Key Fabrication Processes for Integrated Solar Films 10.4: Multilayer Waveguide-Type Light Beam Collecting Films 10.4.1: Simulation Procedure 10.4.2: Light Beam Collection by Light Beam Collecting Films 10.4.3: Overall Consideration for Light Beam Collecting Efficiency 10.5: Thin-Film Artificial Photosynthesis Cells Chapter 11: Embodiments Disclosed in Patents 11.1: Integrated OE MCMs 11.2: 3D Optical Interconnects 11.2.1: Horizontal Layer Attachment 11.2.2: Vertical Layer Attachment 11.3: Micro Optical Link Modules 11.4: Active Optical Sheets, Boards, and Connectors Chapter 12: Future Challenges 12.1: Enhancement of the Pockels Effect by Controlling Wavefunction Shapes 12.2: Molecular Layer Deposition (MLD) 12.3: Growth of Polymer MQDs by MLD Epilogue Index This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects. Currently, light waves are ready to come into boxes of computers in high-performance computing systems.