آزمایش تولید دستگاه‌های RF و سیستم-بر-چیپ برای ارتباطات بی‌سیم (کتابخانه مایکروویو آرتک هاوس)

Schaub and Kelly, both radio frequency (RF) technical consultants, offer an in-depth overview of RF and system-on-chip (SOC) product testing for wireless communications in this resource for SOC applications engineers, engineering managers, product engineers, and students. Early chapters introduce production testing, look at RF and SOC devices, and discuss issues related to costs. These chapters will be especially useful for managers of technical teams. Later chapters are written as a handbook for applications engineers, covering algorithms for production tests performed on discrete RF devices, measurements used with more highly integrated SOC devices, mixed-signal testing, improving test efficiency, and measurement of noise. Team DDU......Page 1 Contents......Page 8 Preface......Page 14 Acknowledgments......Page 18 1.2 Characterization Versus Production Testing......Page 20 1.5 Rack and Stack......Page 21 1.7.1 Handlers......Page 22 1.7.3 Contactor Sockets......Page 24 1.7.4 Production RF and SOC Wafer Probing......Page 25 1.8 Calibration......Page 28 1.11 Accuracy, Repeatability, and Correlation......Page 29 1.13 Built-in Self-Test......Page 30 References......Page 31 2.1 Introduction......Page 32 2.3 RF Power Amplifier......Page 34 2.4 RF Mixer......Page 35 2.5 RF Switch......Page 38 2.6 Variable Gain Amplifier......Page 39 2.7 Modulator......Page 41 2.8 Demodulator......Page 42 2.10 Receiver......Page 43 2.11 Transceiver......Page 44 2.14 Zero Intermediate Frequency Wireless Radio......Page 45 2.15 Phase Locked Loop......Page 47 2.16 RF and SOC Device Tests......Page 49 References......Page 50 3.2 Wafer Processing Improves Cost of Test......Page 52 3.3 Early Testing of the SOC......Page 55 3.5 SOC Cost-of-Test Paradigm Shift......Page 56 3.6 Key Cost-of-Test Modeling Parameters......Page 57 3.6.2 Recurring Cost......Page 58 3.6.4 Utilization......Page 59 3.6.5 Yield......Page 60 3.6.6 Accuracy as It Relates to Yield......Page 61 3.7.1 Multisite and Parallel Testing......Page 64 References......Page 65 4.2 Measuring Voltage Versus Measuring Power......Page 68 4.3 Transmission Line Theory Versus Lumped-Element Analysis......Page 69 4.4 The History of Power Measurements......Page 70 4.5 The Importance of Power......Page 71 4.7 The Decibel......Page 72 4.9 Power......Page 73 4.10 Average Power......Page 74 4.12 Modulated Power......Page 75 4.13 RMS Power......Page 76 4.14 Gain......Page 77 4.14.1 Gain Measurements of Wireless SOC Devices......Page 79 4.15 Gain Flatness......Page 80 4.15.1 Measuring Gain Flatness......Page 82 4.15.2 Automatic Gain Control Flatness......Page 84 4.16 Power-Added Efficiency......Page 86 4.17 Transfer Function for RF Devices......Page 87 4.18 Power Compression......Page 88 4.20 Harmonic and Intermodulation Distortion......Page 91 4.20.1 Harmonic Distortion......Page 92 4.20.2 Intermodulation Distortion......Page 94 4.21.1 The Basics of CDMA......Page 98 4.21.2 Measuring ACPR......Page 100 4.22 Filter Testing......Page 101 4.23.2 How It Is Done......Page 103 4.23.3 S-Parameters of a Two-Port Device......Page 104 4.23.4 Scalar Measurements Related to S-Parameters......Page 105 4.23.5 S-Parameters Versus Transfer Function......Page 107 4.23.7 Characteristics of a Bridge......Page 108 4.23.8 Characteristics of a Coupler......Page 109 4.24 Summary......Page 110 References......Page 111 Appendix 4A: VSWR, Return Loss, and Reflection Coefficient......Page 112 5.1 Introduction......Page 114 5.2 SOC Integration Levels......Page 115 5.3 Origins of Bluetooth......Page 116 5.4 Introduction to Bluetooth......Page 117 5.5 Frequency Hopping......Page 118 5.7 Bluetooth Data Rates and Data Packets......Page 119 5.9 The Parts of a Bluetooth Radio......Page 121 5.10 Phase Locked Loop......Page 122 5.14 How Does a PLL Work?......Page 123 5.15 Synthesizer Settling Time......Page 124 5.17 Power Versus Time......Page 125 5.18 Differential Phase Versus Time......Page 129 5.19 Digital Control of an SOC......Page 131 5.20 Transmitter Tests......Page 132 5.20.1 Transmit Output Spectrum......Page 133 5.20.2 Modulation Characteristics......Page 136 5.20.3 Initial Carrier Frequency Tolerance......Page 137 5.20.4 Carrier Frequency Drift......Page 138 5.20.6 Frequency Pulling and Pushing......Page 139 5.21 Receiver Tests......Page 143 5.21.1 Bit Error Rate......Page 144 5.21.3 Programmable Delay Line Method (XOR Method)......Page 146 5.21.5 BER Testing with a Digital Pin......Page 147 5.21.6 BER Measurement with a Digitizer......Page 149 5.22.1 Sensitivity BER Test......Page 151 5.22.4 Adjacent Channel Interference BER Tests......Page 152 5.22.6 Intermodulation Interference BER Tests......Page 154 5.23.1 I/Q Diagrams......Page 156 5.23.2 Definition of Error Vector Magnitude......Page 157 5.23.3 Making the Measurement......Page 158 5.23.4 Related Signal Quality Measurements......Page 160 5.23.6 Should EVM Be Used for Production Testing?......Page 161 References......Page 162 6.2 Sampling Basics and Conventions......Page 164 6.2.1 DC Offsets and Peak-to-Peak Input Voltages......Page 165 6.3.2 The Fourier Transform......Page 166 6.3.3 The Discrete Fourier Transform......Page 168 6.4.1 Negative Frequency......Page 169 6.4.2 Convolution......Page 170 6.4.3 Frequency- and Time-Domain Transformations......Page 171 6.5 Nyquist Sampling Theory......Page 173 6.6.1 Coherent Sampling and Windowing......Page 175 6.6.2 SNR for AWGs and Digitizers......Page 178 6.6.3 SINAD and Harm Distortion......Page 179 6.7.1 DC Offset......Page 182 6.7.2 INL/DNL for AWGs and Digitizers......Page 183 6.8.1 Differences Between V, W, dB, dBc, dBV, and dBm......Page 184 6.8.2 Transformation Formulas......Page 185 6.10 Phase Noise and Jitter......Page 186 6.11.1 System Considerations for Accurate I/Q Characterization......Page 187 6.11.2 Amplitude and Phase Balance Using Complex FFTs......Page 188 6.12.1 System Gain with Dissimilar Input and Output Impedances......Page 190 6.13 Summary......Page 191 References......Page 192 7.3 Parallel Testing of RF Devices......Page 194 7.4 Parallel Testing of RF SOC Devices......Page 197 7.5 True Parallel RF Testing......Page 198 7.6 Pseudoparallel RF Testing......Page 199 7.7 Alternative Parallel RF Testing Methods......Page 201 7.8 Guidelines for Choosing an RF Testing Method......Page 203 7.9 Interleaving Technique......Page 204 7.10 DSP Threading......Page 205 7.11 True Parallel RF Testing Cost-of-Test Advantages and Disadvantages......Page 206 7.12 Pseudoparallel RF Testing Cost-of-Test Advantages and Disadvantages......Page 207 7.13 Introduction to Concurrent Testing......Page 208 7.14 Design for Test......Page 209 7.15 Summary......Page 210 References......Page 211 8.1.1 Power Spectral Density......Page 212 8.1.2 Types of Noise......Page 213 8.1.3 Noise Floor......Page 217 8.2.1 Noise-Figure Definition......Page 218 8.2.2 Noise Power Density......Page 220 8.2.4 Noise Temperature and Effective Noise Temperature......Page 221 8.2.5 Excess Noise Ratio......Page 222 8.2.7 Mathematically Calculating Noise Figure......Page 223 8.2.8 Measuring Noise Figure......Page 224 8.2.9 Noise-Figure Measurements on Frequency Translating Devices......Page 228 8.2.10 Calculating Error in Noise-Figure Measurements......Page 229 8.2.12 Mismatch Error......Page 230 8.2.15 Averaging and Bandwidth Considerations......Page 231 8.3.1 Introduction......Page 232 8.3.2 Phase-Noise Definition......Page 233 8.3.4 Phase Jitter......Page 235 8.3.8 Trade-offs When Making Phase-Noise Measurements......Page 236 8.3.9 Making Phase-Noise Measurements......Page 237 8.3.11 Phase-Noise Measurement Example......Page 239 References......Page 241 Appendix A: Power and Voltage Conversions......Page 244 Appendix B: RF Coaxial Connectors......Page 248 List of Acronyms and Abbreviations......Page 252 List of Numerical Prefixes......Page 256 About the Authors......Page 258 Index......Page 260 With the increasing number of integrated wireless devices being developed with SOC (system on a chip) technology, a merger of RF and mixed-signal test approaches is quickly becoming a necessity. Addressing this need head-on, this first-of-its-kind resource offers you an in-depth overview of RF and SOC product testing for wireless communications. The book introduces new, creative methods that lead to more efficient testing, such as multi-site and parallel testing. You learn how to determine critical measurements for specific applications, including Bluetooth, WLAN, and 3G devices. Moreover, the book shows you how to perform these measurements cost effectively in a production test environment. This hands-on reference provides you with the time-saving algorithms and practical techniques you need to handle your challenging projects with speed and confidence. The book also offers a thorough understanding of the capital expenditures involved in production testing, to help you make sound investment decisions. You discover a cost-of-test model that helps you compare and contrast production testing methods with ease. Annotation Technological advances have created a need for the merger and rethinking of past testing approaches for wireless equipment. This first-of-its-kind resource offers professionals an in-depth overview of cutting-edge RF (radio frequency) and SOC (system on a chip) product testing for wireless communications