مدل‌سازی مدارهای مایکروویو با استفاده از شبیه‌سازی میدان الکترومغناطیسی (کتابخانه مایکروویو آرتک هاوس)

A "how-to" guide to electromagnetic field-solvers. Many publications in this area are strictly theoretical, but this manual offers engineers advice on selecting the right tools for their RF (radio frequency) and high-speed digital circuit design work. The focus is on the strengths and weaknesses of the major commercial software packages with many tips and techniques on the use and evaluation of each. Real design case study material is included, along with a "what went wrong in the design process" discussion, when applicable Team DDU Microwave Circuit Modeling Using Electromagnetic Field Simulation 1 Cover 1 Contents 8 Preface 16 Chapter 1 Introduction 20 1.1 General Field-Solver Applications 21 1.2 A Note on Color Plots 22 1.3 A Note on 3D Wireframe Views 23 1.4 A Brief Historical View 25 References 27 Chapter 2 CAD of Passive Components 28 2.1 Circuit-Theory-Based CAD 29 2.2 Field-Theory-Based CAD 32 2.3 Solution Time for Circuit Theory and Field Theory 35 2.4 A "Hybrid" Approach to Circuit Analysis 37 2.5 Optimization 42 2.6 Modern Microwave CAD-What's Missing? 43 2.7 The Next Decade 45 References 46 Chapter 3 Numerical Electromagnetics 48 3.1 Microwave Analysis and Design 49 3.2 Methods of Electromagnetic Analysis 51 3.3 The Features Common to All Numerical Methods 53 3.4 The Differences Between Numerical Methods 54 3.5 Categories of Numerical Methods 54 3.6 Expansion Functions 56 3.7 Strategies for Finding the Unknown Coefficients 59 3.8 The Method of Moments 62 3.8.1 2.5D Planar MoM Solvers 68 3.9 The Finite Element Method 69 3.9.1 Linear Expansion Functions and Unknown Coefficients 70 3.9.2 Strategy for Determining the Unknown Expansion Coefficients 72 3.10 Finite Difference and Finite Integration Methods 74 3.10.1 Finite Difference Formulations 74 3.10.2 Finite Integration Formulation 77 3.10.3 Solution Strategies 78 3.11 Finite Difference Time Domain Formulations 80 3.11.1 Stability 84 3.11.2 Initial and Boundary Conditions 85 3.11.3 Output from FDTD Simulators 85 3.12 Transmission Line Matrix Methods 86 3.12.1 TLM Basics and the Two-Dimensional TLM Shunt Mesh 86 3.12.2 The Three-Dimensional Expanded TLM Mesh 89 3.12.3 The Symmetrical Condensed Node TLM Mesh 90 3.12.4 Inhomogeneous Materials and Losses 91 3.12.5 Initial and Boundary Conditions 91 3.12.6 Stability 92 3.13 Output from Electromagnetic Simulators 92 3.14 Discussion and Conclusion 94 3.15 Further Reading 96 References 96 Chapter 4 Alternative Classifications 100 4.1 Classification by Geometry 100 4.1.1 2D Cross-Section-Solvers 100 4.1.2 2.5D Planar-Solvers 102 4.1.3 3D Arbitrary Solvers 103 4.1.4 Summary 104 4.2 Classification by Solution Domain 104 4.2.1 Frequency Domain Solvers 105 4.2.2 Time Domain Solvers 105 4.2.3 Eigenmode-solvers 106 References 107 Chapter 5 Moment Method Simulators 108 5.1 Closed Box Moment Method-Strengths 108 5.2 Closed Box Moment Method-Weaknesses 108 5.3 Laterally Open Moment Method-Strengths 109 5.4 Laterally Open Moment Method-Weaknesses 109 5.5 Issues Common to Both MoM Formulations 110 5.6 Exceptions to General MoM Comments 111 5.7 50-Ohm Microstrip Line 111 5.8 MoM-Cells and Subsections 114 5.9 MoM-Validation Structures 115 5.10 MoM Meshing and Convergence 117 5.10.1 Uniform Versus Edge-Meshing 118 5.10.2 Microstrip Convergence 119 5.10.3 Summary for Meshing and Impedance Convergence 120 5.11 Controlling Meshing 121 5.11.1 Meshing a Microstrip Tee-Junction 122 5.11.2 Meshing a Wiggly Coupler 124 5.11.3 Meshing a Printed Spiral Inductor 124 5.11.4 Meshing Printed Capacitors 126 5.11.5 Meshing Overlay and MIM Capacitors 130 5.11.6 Exceptions to Mesh Control Discussion 132 5.11.7 Summary for Mesh Control 132 5.12 MoM-Displaying Voltage 133 5.13 MoM-Calibration Structures 135 5.13.1 Microstrip Ideal Short Circuit 135 5.13.2 Microstrip Open Circuit 137 5.13.3 Microstrip Thin-Film Resistor 137 5.13.4 Summary for Microstrip Calibration Structures 140 5.14 Visualization 141 References 141 Chapter 6 Finite Element Method Simulators 144 6.1 Finite Element Method-Strengths 144 6.2 Finite Element Method-Weaknesses 146 6.3 FEM Simulators-Validation Structures 147 6.4 Controlling Meshing 147 6.4.1 Meshing The Coaxial Standard-Geometrical Resolution 149 6.4.2 Meshing a Coaxial Resonator-Dummies and Seeding 151 6.4.3 Meshing a Coaxial Step Discontinuity-Dummies and Seeding 156 6.4.4 Solving the Step Discontinuity in 2D 162 6.4.5 Mesh Control Summary 162 6.5 FEM Calibration Structures 164 6.5.1 7-mm Coaxial Through Line 164 6.5.2 7-mm Coaxial Short 166 6.5.3 7-mm Shielded Coaxial Open 167 6.5.4 7-mm Coaxial Termination 168 6.5.5 7-mm Coax-TEM Behavior 169 6.6 Visualization 169 References 170 Chapter 7 FDTD and TLM Simulators 172 7.1 FDTD and TLM-Strengths 172 7.2 FDTD and TLM-Weaknesses 173 7.3 FDTD and TLM-Validation Structures 175 7.3.1 TE101 Mode Convergence 177 7.3.2 Wideband Rectangular Waveguide Validation 179 7.4 Controlling Meshing 182 7.4.1 Meshing the Stripline Standard 184 7.4.2 Meshing the Coaxial Step Discontinuity 185 7.5 Visualization 189 References 189 Chapter 8 Ports and De-embedding 192 8.1 Ports-Connecting Fields to Circuits 192 8.2 De-embedding and Unterminating 195 8.3 Closed Box MoM Ports and De-embedding 199 8.4 Laterally Open MoM Ports and De-embedding 202 8.5 3D FEM Ports and De-embedding 203 8.6 3D FDTD and TLM Ports and De-embedding 206 8.7 Internal, Lumped, and Gap Ports 208 8.7.1 Exceptions to the Comments on Internal Ports 211 8.8 Symmetry and Ports 212 References 215 Chapter 9 Numerical Methods Summary 218 9.1 Meshing 218 9.1.1 Surface Meshing 219 9.1.2 Volume Meshing 219 9.2 Convergence 219 9.2.1 Guide Wavelength 220 9.2.2 Spatial Wavelength 220 9.2.3 Geometrical Resolution 220 9.3 Validation Structures 221 9.4 Calibration Structures 221 9.5 Ports and De-embedding 222 9.5.1 MoM Ports 222 9.5.2 FEM, FDTD, and TLM Ports 223 9.5.3 Internal, Lumped, and Gap Ports 223 Chapter 10 Microstrip 224 10.1 Discontinuities 224 10.2 Microstrip Vias and Slots 226 10.3 Microstrip 3D Vias 228 10.4 Modeling Microstrip Vias 231 10.5 Microstrip Mitered Bend 234 10.6 Microstrip Tee-Junction 236 10.7 Summary for Microstrip Discontinuities 238 10.8 Quasi-TEM Nature of Microstrip 239 10.9 Evanescent Modes in Microstrip 241 10.10 Microstrip Loss 243 10.11 Compaction of Microstrip Circuits 248 10.11.1 Cascade of Mitered Bends 249 10.11.2 Stripline Meander Line 251 10.11.3 Microstrip Branchline Coupler 252 References 253 Chapter 11 Computing Impedance 256 11.1 Single Strip Impedance and Phase Velocity 256 11.2 Single Strip Impedance Using Symmetry 263 11.3 Coupled Line Parameters Using Symmetry 265 11.4 CPW with Dielectric Overlay 269 11.5 Buried Transmission Lines 271 11.6 Other Applications of 2D Cross-Section-Solvers 272 References 273 Chapter 12 Vias, Via Fences, and Grounding Pads 274 12.1 Vias in FR4 274 12.2 A More Advanced Via Model 277 12.3 Summary for Microstrip Single Layer Vias 281 12.4 Via Isolation Fences-Part I 282 12.4.1 2.5D MoM Simulation 282 12.4.2 3D FEM Simulation 286 12.5 Via Isolation Fences-Part II 287 12.6 Grounding Pads 290 12.7 Summary for Grounding Pads 300 References 301 Chapter 13 Multilayer Printed Circuit Boards 302 13.1 A Multilayer Transition in FR4 302 13.2 Controlled Impedance Transitions 309 13.2.1 Analysis Using Closed Box MoM 310 13.2.2 Analysis Using Laterally Open MoM 318 13.2.3 Analysis Using 3D FEM 320 13.3 A 10-GHz Switch Matrix 324 13.4 Summary 330 References 332 Chapter 14 Connectors 334 14.1 RF Edge-Launch Connectors 334 14.2 Digital Edge-Launch Connectors 340 14.3 Another Digital Edge-Launch Example 342 14.4 Through Hole SMA Connectors 345 14.5 Surface Mount SMA Connectors 352 14.6 Summary 355 References 356 Chapter 15 Backward Wave Couplers 358 15.1 PCS Band CPW Coupler 358 15.2 Couplers and Metal Thickness 366 15.3 Lange Couplers 376 15.4 PCS Band 15-dB Coupler 382 15.5 PCS Band Coax-to-Coax Transition 388 References 394 Chapter 16 Microstrip Filters 396 16.1 Interdigital Filters 397 16.2 Edge-Coupled Filters 403 16.3 22.5-GHz Bandpass Filter 406 16.4 3.7-GHz Bandpass Filter 413 16.5 1.5 to 5.5-GHz Bandpass Filter 418 16.6 22.5-GHz Bandstop Filter 420 References 424 Chapter 17 Other Microwave Filters 426 17.1 Coaxial Lowpass Filters 426 17.2 3.5-GHz Combline Filter 433 17.3 2.14-GHz Combline Filter 444 References 450 Chapter 18 Choosing the Right Software 452 18.1 The Solution Process From Start to Finish 452 18.2 Features All Tools Must Have 453 18.3 Features That Are Nice to Have 454 18.4 Visualization 454 18.5 Ease of Use and Total Solution Time 455 18.6 The Right Tool for the Job 456 References 457 Appendix A Survey of Field-Solver Software 458 A.1 2D Cross-Section-Solvers 458 A.1.1 Stand-Alone Software–PDE Solvers 458 A.1.2 Stand-Alone 2D Electrostatic Solvers 460 A.1.3 Summary for Stand-Alone 2D Solvers 461 A.1.4 Integrated 2D Field-Solvers 462 A.1.5 Summary for Integrated 2D Field-Solvers 464 A.2 2.5D Planar Solvers (3D Mostly Planar) 464 A.3 3D Arbitrary Geometry Solvers 468 Appendix B List of Software Vendors 472 Appendix C List of Internet Sites 476 About the Authors 478 Index 480 This unique how-to book is an ideal introduction to electromagnetic field-solvers. It provides professionals with helpful advice on selecting the right tools for their RF and high-speed digital circuit design work. The focus is on the strengths and weaknesses of the major commercial software packages. Featuring full-color illustrations, this practical resource offers you invaluable tips and techniques on the use and evaluation of these products. A generous amount of case study material is presented, including a "what went wrong in the design process" discussion, when applicable. Color plots of current density and various field quantities included throughout the book help practitioners better understand the fundamental behavior of the circuits being studied. The book stresses the impact of meshing, geometrical resolution, and convergence on the solution process, explaining how to better control and greatly influence the quality and speed of the solution. Microwave Circuit Modeling Using Electromagnetic Field Simulation also features specific design information on transitions in multilayer PCBs and PCB connectors that is not available in any other book. The authors begin by describing the more popular numerical methods for solving Maxwell's equations by means of electromagnetic simulators or field solvers. They then discuss meshing, convergence, and de-embedding, and explain how to model microstrip components, vias, multilayer printed circuit boards, connectors, backward wave couplers, and filters. Design case studies demonstrate the trade-offs and compromises that must be made to get an efficient solution, and document situations where the modeling process did not work correctly the first time and what was needed to correct the model. False color current and field plots are provided. Annotation (c) Book News, Inc., Portland, OR (booknews.com) Annotation This practical "how to" book is an ideal introduction to electromagnetic field-solvers. Where most books in this area are strictly theoretical, this unique resource provides engineers with helpful advice on selecting the right tools for their RF (radio frequency) and high-speed digital circuit design work