بسته‌بندی الکترونیکی مایکروویو و میلی‌متری

Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. -- Abstract: Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs Microwave Microwave and Millimeter-Wave Electronic Packaging 4 Contents 8 Preface 16 1 Introduction 20 1.1 Distributed Effects 23 1.1.1 Distributed Effects in Lumped Elements 23 1.1.2 Undesired Resonances 25 1.1.3 Transmission Lines 29 1.1.4 Dispersion Effects 39 1.1.5 Coupling and Cross-Talk Between Signal Lines 40 1.1.6 Parasitic and Grounding Concerns 45 1.2 Thermal Effects 48 1.3 First-Level Interconnects 50 1.4 Second-Level Interconnects 52 1.5 Modules 53 1.6 Conclusions 53 Questions 54 References 55 2 Materials 58 2.1 Electrical Parameters and Their Measurement 60 2.1.1 Dielectric Constant 60 2.1.2 Loss Tangent 65 2.1.3 Measurement of Dielectric Constants and Loss Tangents 66 2.1.4 Metal Electrical Conductivity 75 2.2 Mechanical Parameters 77 2.2.1 Thermal Conductivity 77 2.2.2 Thermal Expansion 79 2.2.3 Stress and Strain 80 2.2.4 Young’s Modulus 80 Questions 82 References 83 3 Ceramic Packaging 86 3.1 History of Ceramics 87 3.2 Thin-Film Ceramics 88 3.3 Advanced Thin-Film Techniques 96 3.4 Thick-Film Ceramics 97 3.4.1 Thick-Film Paste 98 3.4.2 Squeegee 99 3.4.3 Frame 99 3.4.4 Screen and Mesh 99 3.4.5 Emulsion 100 3.4.6 Desired Metal Pattern 100 3.4.7 Ceramic Substrate 100 3.4.8 Printing Machine 100 3.4.9 Etching 100 3.4.10 Postprocessing 101 3.5 Thermally Enhanced Thick-Film Processes 101 3.6 High-Temperature Cofired Ceramic (HTCC) 101 3.6.1 Slurry 102 3.6.2 Tape Casting 103 3.6.3 Punching 103 3.6.4 Via Filling and Conductor Printing 104 3.6.5 Stacking, Pressing, and Cofiring 104 3.6.6 Postprocessing 105 3.7 Low-Temperature Cofired Ceramic (LTCC) 105 Questions 106 References 107 4 Laminate Packaging 110 4.1 Laminate Board Fabrication 111 4.1.1 Database Review and Acceptance 111 4.1.2 Artwork Generation 112 4.1.3 Clean Layers 112 4.1.4 Pattern and Etch 112 4.1.5 Bake-Out 112 4.1.6 Oxide Treatment of Inner Layers for Adhesion 112 4.1.7 Alignment and Lamination 113 4.1.8 Drill and Deburr 113 4.1.9 Through-Hole Plating 113 4.1.10 Solder Mask 114 4.1.11 Finish Plating 114 4.1.12 Silk Screen and CNC Routing 115 4.1.13 Electrical Testing and Inspection 115 4.2 Cost of Laminates 115 4.3 Laminate Circuit Board Tolerances 117 4.4 High-Performance Laminate Materials 120 4.5 Liquid Crystal Polymer 121 4.6 Laminate Multichip Modules 122 4.7 Conclusions 123 Questions 123 References 124 5 First-Level Interconnects 126 5.1 Wire Bond Interconnects 126 5.1.1 Wire Bond Manufacturing 127 5.1.2 Wire Bond Reliability 129 5.1.3 Wire Bond Electrical Performance and Modeling 131 5.1.4 Straight Wire Bond Between Substrates 132 5.1.5 Wire Bond Between an MMIC and Substrate 139 5.1.6 Ground Current Parasitics in Wire Bonded Circuits 141 5.1.7 Tuning Wire Bond Interconnects 143 5.1.8 Other RF Uses for Wire Bonds 143 5.2 Ribbon Bonding 145 5.3 Flip Chip Interconnects 145 5.3.1 Types of Flip Chip Interconnects 147 5.3.2 Electrical Modeling of Flip Chip Interconnects 148 5.3.3 Parasitic Modes in Flip Chip Interconnects 154 5.3.4 Thermal Concerns for Flip Chips 158 Questions 158 References 159 6 Second-Level Interconnects 162 6.1 Electrical Modeling of Surface-Mount Packages 165 6.2 Inductance and Capacitance Matrix Method for Package Model Extraction 166 6.3 Coupled-π Model Method 170 6.4 Hybrid Circuit Model 176 Questions 178 References 178 7 Modules and Motherboards 180 7.1 Proper Transmission Line Design 181 7.1.1 Conductor-Backed Coplanar Waveguide 181 7.1.2 Striplines 187 7.1.3 Microstrip Lines 190 7.2 Vias for Isolation and Grounding 194 7.3 Cavity Resonances 195 Questions 196 References 197 8 Transitions and 3D Packaging 200 8.1 Transitions Between Transmission Lines 201 8.1.1 CBCPW to Microstrip Transition 202 8.1.2 Cofired Ceramic Microstrip and Stripline Transition 202 8.1.3 Laminate Board Microstrip to Stripline Transition 208 8.2 Three-Dimensional Packaging 209 8.2.1 Stacked Substrate Solderless Interconnects 209 8.2.2 Highly Integrated Modules with Vertical Transitions 214 8.2.3 Using the Package as a Circuit Element: An Integrated 60-GHz Module 215 8.2.4 Three-Dimensional Integration by Stacking ICs and Packages 215 8.3 Conclusions 216 Questions 217 References 217 9 Heat Transfer 220 9.1 Heat Transfer Mechanisms 220 9.2 Amplifier Efficiency and Dissipated Thermal Power 222 9.3 Reliability and Arrhenius Equation 224 9.4 Device Junction Temperature 227 9.5 Junction Temperature with Multiple Material Layers 228 9.6 Thermal Simulations Using Spice 231 9.7 Thermal Simulation Using the Finite Difference Method 232 9.8 Conclusions 235 Questions 235 References 236 10 Electromagnetic Modeling 238 10.1 Quasistatic Simulation of Transmission Lines 242 10.2 Method of Moments 246 10.3 Finite Element Method 247 10.4 Finite Difference Time Domain Method 247 10.5 Mode Matching Technique 248 10.6 Integrated Methods 248 10.7 Domain Decomposition Methods 249 Questions 249 References 250 11 Conclusions and Future Horizons 252 11.1 The 10 Keys to Successful Packaging 253 11.1.1 Careful System Architecture and Solid Specifications 253 11.1.2 Proper Material Selection 254 11.1.3 Electrical Signal Integrity 254 11.1.4 Thermal Management 255 11.1.5 Proper Electrical Modeling 255 11.1.6 Proper Mechanical Modeling 255 11.1.7 Design for Manufacturing 255 11.1.8 Design for Testability 256 11.1.9 Production Process Transition 256 11.1.10 Proper Feedback from Field Failures 256 11.2 Future for Packaging at Microwave Frequencies 256 11.3 Drive for Lower Cost Packaging at Millimeter-Wave Frequencies 257 References 257 Appendix A 260 A.1 Scattering Parameters 260 A.2 Impedance Parameters 262 Appendix B 264 B.1 Multilayer Transmission Line Tool 264 B.2 Physical Parameters 264 B.3 Numerical Control 265 B.4 Analysis 265 Appendix C 268 C.1 Thermal Calculator Software Tool 268 About the Author 270 Index 272 Mircowave;,Wave,electronic,packaging;,Artech,House;,978-1-60807-697-0 Mircowave,Wave electronic packaging,Artech House,978-1-60807-697-0 Packaging of electronic components at microwave and millimeter wave frequencies requires the same level of engineering effort as lower frequency electronics plus a set of additional activities that are unique due to the higher frequency of operation. Without careful attention to these additional issues, it is not possible to successfully engineer electronic packaging at these bands. This new resource presents the electronic packaging issues unique to the microwave and millimeter-wave bands and reviews lower-frequently packaging techniques and how they can be tailored or analyzed for higher-frequently design. Readers are provided with 30 practical example, along with 2 free downloadable software analysis program. Book jacket Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs. You are provided with 30 practical examples throughout the book, as well as three free downloadable software analysis programs. Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. -- Edited summary from book