Microelectronics Failure Analysis: Desk Reference, Sixth Edition

This updated reference book, prepared by experts in their fields, contains dozens of articles covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips. Topic coverage includes: Failure Analysis Process Flow, Failure Verification, Failure Modes and Failure Classification, Special Devices (MEMS, Optoelectronics, Passives, Fault Localization Techniques: Package Level (NDT), Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods, Deprocessing & Imaging Techniques: Deprocessing, General Imaging Techniques, Local Deprocessing & Imaging, Circuit Edit and Design Modification, Material Analysis Techniques, Reference Information: Important Topics for Semiconductor Devices, Failure Analysis Techniques Roadmap, Failure Analysis Operations and Management, Appendices: Failure Analysis Terms, Definitions, and Acronyms, Industry Standards Contents......Page 6 Preface to the Sixth Edition......Page 12 The Failure Analysis Process......Page 14 System Level Failure Analysis Process: Making Failure Analysis a Value Add Proposition in Today's High Speed Low Cost PC Environment......Page 29 Board Level Failure Mechanisms and Analysis in Hand-Held Electronic Products......Page 36 Failure Analysis Flow for Package Failures......Page 47 Chip-Scale Packages and Their Failure Analysis Challenges......Page 53 Wafer Level Failure Analysis Process Flow......Page 62 Failure Analysis of Microelectromechanical Systems (MEMS)......Page 65 Failure Analysis and Reliability of Optoelectronic Devices......Page 91 Solar Photovoltaic Module Failure Analysis......Page 112 DRAM Failure Analysis and Defect Localization Techniques......Page 117 Failure Analysis of Passive Components......Page 124 Reliability and Quality Basics for Failure Analysts......Page 134 Electronics and Failure Analysis......Page 141 Submicron CMOS Devices......Page 162 Analog Device and Circuit Characterization......Page 172 Screening for Counterfeit Electronic Parts......Page 184 An Overview of Analog Design for Test and Diagnosis......Page 194 An Overview of Integrated Circuit Testing Methods......Page 203 Diagnosis of Scan Logic and Diagnosis Driven Failure Analysis......Page 212 Interpretation of Power DMOS Transistor Characteristics Measured with Curve Tracer......Page 222 High-Volume Scan Analysis: Methods to Avoid Failure Analysis......Page 231 Differentiating between EOS and ESD Failures for ICs......Page 238 The Power of Semiconductor Memory Failure Signature Analysis......Page 252 Beam-Based Defect Localization Techniques......Page 259 Electron Beam Probing......Page 276 Failure Localization with Active and Passive Voltage Contrast in FIB and SEM......Page 282 Fundamentals of Photon Emission (PEM) in Silicon – Electroluminescence for Analysis of Electronic Circuit and Device Functionality......Page 292 Picosecond Imaging Circuit Analysis – PICA......Page 305 Current Imaging Using Magnetic Field Sensors......Page 314 Thermal Defect Detection Techniques......Page 323 Thermal Failure Analysis by IR Lock-In Thermography......Page 343 Principles of Thermal Laser Stimulation Techniques......Page 353 Introduction to Laser Voltage Probing (LVP) of Integrated Circuits......Page 362 CAD Navigation in FA and Design/Test Data for Fast Fault Isolation......Page 367 Acoustic Microscopy of Semiconductor Packages......Page 375 Electronic Package Fault Isolation Using TDR......Page 396 Delayering Techniques: Dry Processes Wet Chemical Processing and Parallel Lapping......Page 410 The Art of Cross Sectioning......Page 430 Delineation Etching of Semiconductor Cross Sections......Page 450 Special Techniques for Backside Deprocessing......Page 453 Deprocessing Techniques for Copper, Low K, and SOI Devices......Page 458 Optical Microscopy......Page 470 Scanning Electron Microscopy......Page 490 Ultra-High Resolution in the Scanning Electron Microscope......Page 510 Transmission Electron Microscopy for Failure Analysis of Semiconductor Devices......Page 519 X-ray Imaging Tools for Electronic Device Failure Analysis......Page 542 Atomic Force Microscopy: Modes and Analytical Techniques with Scanning Probe Microscopy......Page 549 Energy Dispersive X-ray Analysis......Page 562 Analysis of Submicron Defects by Auger Electron Spectroscopy (AES)......Page 574 SIMS Solutions for Next Generation IC Processes and Devices......Page 586 Focused Ion Beam (FIB) Systems: A Brief Overview......Page 596 Circuit Edit at First Silicon......Page 607 The Process of Editing Circuits through the Bulk Silicon......Page 620 Education and Training for the Analyst......Page 625 Management Principles and Practices for the Failure Analysis Laboratory......Page 630 Managing the Unpredictable – A Business Model for Failure Analysis Service......Page 640 Failure Analysis Terms and Definitions......Page 648 P......Page 664 Y......Page 665 C......Page 666 D......Page 667 F......Page 668 M......Page 669 O......Page 670 S......Page 671 T......Page 672 Y......Page 673