راهنمای مرجع تحلیل شکست میکروالکترونیک، 2001

How did you learn failure analysis? You took your background in physics, electrical engineering, chemistry, biology, or chemical engineering and were thrown into the lab for your on-the-job-training. You read abundantly in the ISTFA Proceedings, Electron Device Failure Analysis Magazine (EDFA), and equipment manuals, attended tutorials, and perhaps found a book or two. However, the single best source for all information was the ASM/EDFAS Desk Reference. You are reading the 5th Edition of the Desk Reference, and it updates the field for leading edge techniques as well as retaining the tried and true methods. It also has a reference section to bring us all into a common understanding of the basic physics and electronics of the chips that we analyze. CD-ROM content is in fully searchable Adobe Acrobat PDF format, Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee. Provides new or expanded coverage on important techniques for microelectronic failure analysis. Contents include: Backside isolation techniques; Flip-chip focused ion beam backside navigation; Circuit validation techniques; Copper metallization deprocessing; Tunnelling atomic force microscopy; Scanning capacitance microscopy; Scanning probe microscopy; Packaging and chip cross-sectioning; Glossary of failure analysis tool acronyms; Updated key word index to ISTFA Proceedings volumes and to the Microelectronic Failure Analysis Desk Reference, 4th Edition. (+VAT on UK orders)