تحلیل شکست میکروالکترونیکی: مرجع میز کار: ضمیمه ۲۰۰۱

Contents......Page 4 FIB Backside Isolation Techniques......Page 5 The SEM Lab, From Laboratory Logistics to Final Sample Preparation Techniques for SEM Analysis of Semiconductors......Page 23 Cross Sectioning with a Pivoting Sample Block......Page 39 Focused Ion Beam Cross Sectioning as a Compliment or an Alternative to Conventional Mechanical Sectioning Techniques......Page 45 Alternatives to Cross-Sectional Sample Preparation for Package and Board-Level Failure Analysis......Page 51 Automation To Boost Productivity And Increase Repeatability: (A sampling of available tools and vendors)......Page 61 Multi-Functional, Semi-Automatic Sample Preparation for Failure Analysis......Page 63 SMPT© - Sub-Micron Polishing Technology For Automated Sample Preparation......Page 69 Automated Techniques For SEM And TEM Sample Preparation......Page 73 Sample Preparation Techniques for Site-Specific Cross-Sectional Analysis of High-Aspect-Ratio FIB Repair Sites......Page 79 Deprocessing, Cross-Sectioning and FIB Circuit Modification of Parts Having Copper Metallization......Page 89 Scanning Capacitance Microscopy of Junction and Non-Junction Samples......Page 101 Electrical Probing of Deep Sub-Micron Integrated Circuits Using Scanning Probe Techniques......Page 117 Application of Tunneling Atomic Force Microscopy (TUNA) to Failure Analysis......Page 127 Glossary of Failure Analysis Tool Acronyms......Page 143 ISTFA Subject Index......Page 149