Materials for Electronic Packaging

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors. Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science. Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems. Front Cover......Page 1 Materials for Electronic Packaging......Page 4 Copyright Page......Page 5 Contents......Page 6 Contributors......Page 12 Preface......Page 14 Part I: Overview......Page 16 1.1 Introduction......Page 18 1.2 Printed Circuit Boards......Page 31 1.3 Substrates......Page 34 1.4 Interconnections......Page 42 1.5 Die Attach......Page 45 1.6 Encapsulation......Page 46 1.7 Interlayer Dielectrics......Page 48 1.8 Heat Sinks......Page 49 1.9 Electromagnetic Interference Shielding......Page 50 References......Page 51 Part II: Joining......Page 56 2.1 Introduction......Page 58 2.2 Background......Page 59 2.3 A Microscopic Mass Transfer Model......Page 63 2.4 Observations of Limiting Mass Transfer......Page 65 2.5 Solder Alloy Selection and Process Design......Page 69 2.6 Conclusion......Page 70 References......Page 71 3.1 Introduction......Page 72 3.2 Test Methodology and Data Analysis......Page 73 3.3 Deformation Behaviour of Pb–Sn Solders under Static and Cyclic Loading......Page 79 3.5 Lifetime Predictive Equation for Pb–Sn Solders......Page 85 Acknowledgment......Page 90 References......Page 91 4.1 Introduction......Page 94 4.2 Fluxless Laser Soldering......Page 96 4.3 Activated Acid Vapor Fluxless Soldering......Page 101 4.4 Laser Ablative Fluxless Soldering......Page 108 4.5 Summary and Examples......Page 116 Acknowledgments......Page 117 References......Page 118 5.1 Introduction......Page 120 5.2 Fracture Behavior......Page 122 5.3 Grain Distributions in the Metal Layer......Page 125 5.4 The Interface Pore Distribution......Page 130 5.5 Interface Roughness......Page 134 References......Page 138 Part III: Composites......Page 140 6.1 Introduction......Page 142 6.2 Status of Composite Packaging Materials......Page 143 6.3 Applications......Page 150 6.4 Future Directions......Page 154 References......Page 157 7.1 Introduction......Page 160 7.2 Heat Sinks, Backboards, and Substrates......Page 162 7.3 Brazes and Solders......Page 164 7.4 Die Attach......Page 165 References......Page 167 8.1 Introduction......Page 168 8.2 Particles as the Filler......Page 170 8.3 Flakes and Fibers as Fillers......Page 171 8.4 Three-Dimensional Networks as Fillers......Page 176 8.6 Effect of the Polymer Viscosity......Page 179 8.7 z-Axis Conductors......Page 180 8.8 Electrically Insulating but Thermally Conducting Composites......Page 183 8.9 Conclusion......Page 184 References......Page 185 Part IV: Metal Films......Page 188 9.2 Overview of Materials and Processes......Page 190 9.3 Resistors......Page 193 9.4 Conductors......Page 200 9.5 Dielectrics......Page 209 9.6 Vehicles......Page 214 9.7 Thick Film Processing......Page 217 9.8 Conclusion......Page 235 10.1 Introduction......Page 236 10.2 Electroless Copper Deposition......Page 239 10.3 Copper Nanoline Processing......Page 242 10.4 Electrical Properties......Page 248 10.5 Electroless Copper Oxidation......Page 250 10.6 Hydrogen in Electroless Copper......Page 251 Acknowledgments......Page 254 References......Page 255 11.2 Vacuum Processes......Page 256 11.3 Coating Vessels......Page 261 11.4 Physical Vapor Deposition by Evaporation......Page 262 11.5 Evaporation Methods and Sources......Page 266 11.6 Sputtering......Page 269 11.7 Heat Transfer in Physical Vapor Deposition Processes......Page 278 11.8 Roll Coater Metallization......Page 280 11.9 Coating Material Properties......Page 281 11.10 Evaluating Deposited Films......Page 282 11.11 Conclusions......Page 291 References......Page 292 Part V: Polymers and Other Materials......Page 294 12.2 Why Do Devices Need Encapsulation?......Page 296 12.3 General Chemistry of Silicones (Elastomers and Gels)......Page 299 12.4 Results and Discussion......Page 301 12.6 Temperature Cycle Testing......Page 303 References......Page 304 13.1 Introduction......Page 306 13.2 Experimental......Page 307 13.3 Results and Discussion......Page 310 13.4 Summary......Page 315 References......Page 316 14.1 Introduction......Page 318 14.2 Organic Conductors and Superconductors......Page 320 14.3 Conducting Polymers......Page 327 14.4 Potential Applications of Conducting Polymers......Page 329 References......Page 330 15.2 Background on Diamond......Page 334 15.3 Chemical Vapor Deposition of Diamond......Page 336 15.4 Fabrication of Electronic Substrates......Page 346 15.5 Package Design Considerations......Page 348 References......Page 350 Part Vl: Materials Testing......Page 354 16.1 Introduction......Page 356 16.2 Electrical Properties......Page 359 16.3 Thermal Properties......Page 361 16.4 Mechanical Properties......Page 367 16.6 Manufacturability Properties......Page 370 16.7 Summary......Page 371 References......Page 372 Index......Page 376 Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.

The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors.
Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science.
Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems.