عناصر تجمیع شده برای مدارهای RF و مایکروویو (کتابخانه مایکروویو آرتک هاوس)

Due to the unprecedented growth in wireless applications, development of low-cost solutions for RF and microwave communication systems has become of great importance. This is a comprehensive treatment of lumped elements, which are playing a critical role in the development of the circuits that make these cost-effective systems possible. The work offers an in-depth understanding of the different types of RF and microwave circuit elements, including inductors, capacitors, resistors, transformers, via holes, airbridges and crossovers. Supported with over 220 equations and more than 200 illustrations, it covers the practical aspects of each element in detail. From materials, fabrication and analyses to design, modelling and physical, electrical and thermal applications, this resource offers coverage of the critical topics for work in the field. Lumped Elements for RF and Microwave Circuits 4 Lumped Elements for RF and Microwave Circuits 4 Copyright 5 Contents 8 Preface 18 Acknowledgments 20 1 Introduction 22 1.1 History of Lumped Elements 22 1.2 Why Use Lumped Elements for RF and Microwave Circuits? 23 1.3 L, C, R Circuit Elements 25 1.4 Basic Design of Lumped Elements 27 1.4.1 Capacitor 28 1.4.2 Inductor 29 1.4.3 Resistor 29 1.5 Lumped- Element Modeling 30 1.6 Fabrication 32 1.7 Applications 33 References 34 2 Inductors 38 2.1 Introduction 38 2.2 Basic Definitions 39 2.2.1 Inductance 39 2.2.2 Magnetic Energy 39 2.2.3 Mutual Inductance 41 2.2.4 Effective Inductance 41 2.2.5 Impedance 42 2.2.6 Time Constant 42 2.2.7 Quality Factor 43 2.2.8 Self- Resonant Frequency 44 2.2.9 Maximum Current Rating 44 2.2.10 Maximum Power Rating 44 2.2.11 Other Parameters 44 2.3 Inductor Configurations 45 2.4 Inductor Models 46 2.4.1 Analytical Models 46 2.4.2 Coupled- Line Approach 49 2.4.3 Mutual Inductance Approach 55 2.4.4 Numerical Approach 57 2.4.5 Measurement- Based Model 59 2.5 Coupling Between Inductors 66 2.5.1 Low- Resistivity Substrates 66 2.5.2 High- Resistivity Substrates 67 2.6 Electrical Representations 71 2.6.1 Series and Parallel Representations 71 2.6.2 Network Representations 72 References 73 3 Printed Inductors 78 3.1 Inductors on Si Substrate 79 3.1.1 Conductor Loss 81 3.1.2 Substrate Loss 84 3.1.3 Layout Considerations 85 3.1.4 Inductor Model 86 3.1.5 Q- Enhancement Techniques 90 3.1.6 Stacked- Coil Inductor 101 3.1.7 Temperature Dependence 105 3.2 Inductors on GaAs Substrate 107 3.2.1 Inductor Models 108 3.2.2 Figure of Merit 109 3.2.3 Comprehensive Inductor Data 109 3.2.4 Q- Enhancement Techniques 125 3.2.5 Compact Inductors 133 3.2.6 High Current Handling Capability Inductors 137 3.3 Printed Circuit Board Inductors 139 3.4 Hybrid Integrated Circuit Inductors 142 3.4.1 Thin- Film Inductors 142 3.4.2 Thick- Film Inductors 145 3.4.3 LTCC Inductors 147 3.5 Ferromagnetic Inductors 148 References 150 4 Wire Inductors 158 4.1 Wire- Wound Inductors 158 4.1.1 Analytical Expressions 158 4.1.2 Compact High- Frequency Inductors 165 4.2 Bond Wire Inductor 167 4.2.1 Single and Multiple Wires 168 4.2.2 Wire Near a Corner 171 4.2.3 Wire on a Substrate Backed by a Ground Plane 172 4.2.4 Wire Above a Substrate Backed by a Ground Plane 174 4.2.5 Curved Wire Connecting Substrates 175 4.2.6 Twisted Wire 176 4.2.7 Maximum Current Handling of Wires 176 4.3 Wire Models 177 4.3.1 Numerical Methods for Bond Wires 177 4.3.2 Measurement- Based Model for Air Core Inductors 177 4.3.3 Measurement- Based Model for Bond Wires 179 4.4 Magnetic Materials 181 References 182 5 Capacitors 184 5.1 Introduction 184 5.2 Capacitor Parameters 186 5.2.1 Capacitor Value 186 5.2.2 Effective Capacitance 187 5.2.3 Tolerances 187 5.2.4 Temperature Coefficient 187 5.2.5 Quality Factor 188 5.2.6 Equivalent Series Resistance 188 5.2.7 Series and Parallel Resonances 188 5.2.8 Dissipation Factor or Loss Tangent 191 5.2.9 Time Constant 191 5.2.10 Rated Voltage 191 5.2.11 Rated Current 191 5.3 Chip Capacitor Types 192 5.3.1 Multilayer Dielectric Capacitor 192 5.3.2 Multiplate Capacitor 193 5.4 Discrete Parallel Plate Capacitor Analysis 194 5.4.1 Vertically Mounted Series Capacitor 194 5.4.2 Flat- Mounted Series Capacitor 197 5.4.3 Flat- Mounted Shunt Capacitor 198 5.4.4 Measurement- Based Model 199 5.5 Voltage and Current Ratings 202 5.5.1 Maximum Voltage Rating 202 5.5.2 Maximum RF Current Rating 202 5.5.3 Maximum Power Dissipation 203 5.6 Capacitor Electrical Representation 206 5.6.1 Series and Shunt Connections 206 5.6.2 Network Representations 208 References 209 6 Monolithic Capacitors 212 6.1 MIM Capacitor Models 213 6.1.1 Simple Lumped Equivalent Circuit 214 6.1.2 Coupled Microstrip- Based Distributed Model 215 6.1.3 Single Microstrip- Based Distributed Model 219 6.1.4 EC Model for MIM Capacitor on Si 223 6.1.5 EM Simulations 225 6.2 High- Density Capacitors 227 6.2.1 Multilayer Capacitors 229 6.2.2 Ultra- Thin- Film Capacitors 232 6.2.3 High- K Capacitors 233 6.2.4 Fractal Capacitors 233 6.2.5 Ferroelectric Capacitors 235 6.3 Capacitor Shapes 237 6.3.1 Rectangular Capacitors 238 6.3.2 Circular Capacitors 239 6.3.3 Octagonal Capacitors 239 6.4 Design Considerations 241 6.4.1 Q- Enhancement Techniques 241 6.4.2 Tunable Capacitor 244 6.4.3 Maximum Power Handling 244 References 248 7 Interdigital Capacitors 250 7.1 Interdigital Capacitor Models 251 7.1.1 Approximate Analysis 251 7.1.2 J- Inverter Network Equivalent Representation 256 7.1.3 Full- Wave Analysis 257 7.1.4 Measurement- Based Model 259 7.2 Design Considerations 260 7.2.1 Compact Size 260 7.2.2 Multilayer Capacitor 262 7.2.3 Q- Enhancement Techniques 265 7.2.4 Voltage Tunable Capacitor 268 7.2.5 High- Voltage Operation 270 7.3 Interdigital Structure as a Photodetector 270 References 272 8 Resistors 274 8.1 Introduction 274 8.2 Basic Definitions 276 8.2.1 Power Rating 276 8.2.2 Temperature Coefficient 277 8.2.3 Resistor Tolerances 277 8.2.4 Maximum Working Voltage 277 8.2.5 Maximum Frequency of Operation 278 8.2.6 Stability 278 8.2.7 Noise 278 8.2.8 Maximum Current Rating 278 8.3 Resistor Types 278 8.3.1 Chip Resistors 279 8.3.2 MCM Resistors 279 8.3.3 Monolithic Resistors 279 8.4 High- Power Resistors 286 8.5 Resistor Models 288 8.5.1 EC Model 289 8.5.2 Distributed Model 290 8.5.3 Meander Line Resistor 291 8.6 Resistor Representations 293 8.6.1 Network Representations 293 8.6.2 Electrical Representations 293 8.7 Effective Conductivity 295 8.8 Thermistors 297 References 297 9 Via Holes 300 9.1 Types of Via Holes 300 9.1.1 Via Hole Connection 300 9.1.2 Via Hole Ground 302 9.2 Via Hole Models 303 9.2.1 Analytical Expression 304 9.2.2 Quasistatic Method 305 9.2.3 Parallel Plate Waveguide Model 307 9.2.4 Method of Moments 308 9.2.5 Measurement- Based Model 310 9.3 Via Fence 311 9.3.1 Coupling Between Via Holes 314 9.3.2 Radiation from Via Ground Plug 314 9.4 Plated Heat Sink Via 315 9.5 Via Hole Layout 315 References 317 10 Airbridges and Dielectric Crossovers 320 10.1 Airbridge and Crossover 320 10.2 Analysis Techniques 322 10.2.1 Quasistatic Method 322 10.2.2 Full- Wave Analysis 327 10.3 Models 329 10.3.1 Analytical Model 329 10.3.2 Measurement- Based Model 331 References 336 11 Transformers and Baluns 338 11.1 Basic Theory 339 11.1.1 Parameters Definition 339 11.1.2 Analysis of Transformers 340 11.1.3 Ideal Transformers 343 11.1.4 Equivalent Circuit Representation 344 11.1.5 Equivalent Circuit of a Practical Transformer 346 11.1.6 Wideband Impedance Matching Transformers 347 11.1.7 Types of Transformers 350 11.2 Wire- Wrapped Transformers 350 11.2.1 Tapped Coil Transformers 350 11.2.2 Bond Wire Transformer 353 11.3 Transmission- Line Transformers 353 11.4 Ferrite Transformers 357 11.5 Parallel Conductor Winding Transformers on Si Substrate 360 11.6 Spiral Transformers on GaAs Substrate 362 11.6.1 Triformer Balun 365 11.6.2 Planar- Transformer Balun 366 References 370 12 Lumped-Element Circuits 374 12.1 Passive Circuits 374 12.1.1 Filters 374 12.1.2 Hybrids and Couplers 377 12.1.3 Power Dividers/ Combiners 391 12.1.4 Matching Networks 393 12.1.5 Lumped- Element Biasing Circuit 398 12.2 Control Circuits 401 12.2.1 Switches 402 12.2.2 Phase Shifters 408 12.2.3 Digital Attenuator 411 References 413 13 Fabrication Technologies 416 13.1 Introduction 416 13.1.1 Materials 417 13.1.2 Mask Layouts 422 13.1.3 Mask Fabrication 422 13.2 Printed Circuit Boards 423 13.2.1 PCB Fabrication 425 13.2.2 PCB Inductors 426 13.3 Microwave Printed Circuits 426 13.3.1 MPC Fabrication 428 13.3.2 MPC Applications 429 13.4 Hybrid Integrated Circuits 431 13.4.1 Thin- Film MICs 431 13.4.2 Thick- Film Technology 433 13.4.3 Cofired Ceramic and Glass- Ceramic Technology 435 13.5 GaAs MICs 437 13.5.1 MMIC Fabrication 439 13.5.2 MMIC Example 442 13.6 CMOS Fabrication 442 13.7 Micromachining Fabrication 445 References 446 14 Microstrip Overview 450 14.1 Design Equations 450 14.1.1 Characteristic Impedance and Effective Dielectric Constant 450 14.1.2 Effect of Strip Thickness 452 14.2 Design Considerations 453 14.2.1 Effect of Dispersion 454 14.2.2 Microstrip Losses 454 14.2.3 Quality Factor Q 456 14.2.4 Enclosure Effect 459 14.2.5 Frequency Range of Operation 464 14.2.6 Power- Handling Capability 465 14.3 Coupled Microstrip Lines 477 14.3.1 Even- Mode Capacitance 478 14.3.2 Odd- Mode Capacitance 479 14.3.3 Characteristic Impedances 480 14.3.4 Effective Dielectric Constants 480 14.4 Microstrip Discontinuities 481 14.5 Compensated Microstrip Discontinuities 482 14.5.1 Step- in- Width 482 14.5.2 Chamfered Bend 483 14.5.3 T- Junction 484 References 486 Appendix 490 About the Author 492 Index 494 Lumped Elements for RF and Microwave Circuits......Page 4 Copyright......Page 5 Contents......Page 8 Preface......Page 18 Acknowledgments......Page 20 1.1 History of Lumped Elements......Page 22 1.2 Why Use Lumped Elements for RF and Microwave Circuits?......Page 23 1.3 L, C, R Circuit Elements......Page 25 1.4 Basic Design of Lumped Elements......Page 27 1.4.1 Capacitor......Page 28 1.4.3 Resistor......Page 29 1.5 Lumped- Element Modeling......Page 30 1.6 Fabrication......Page 32 1.7 Applications......Page 33 References......Page 34 2.1 Introduction......Page 38 2.2.2 Magnetic Energy......Page 39 2.2.4 Effective Inductance......Page 41 2.2.6 Time Constant......Page 42 2.2.7 Quality Factor......Page 43 2.2.11 Other Parameters......Page 44 2.3 Inductor Configurations......Page 45 2.4.1 Analytical Models......Page 46 2.4.2 Coupled- Line Approach......Page 49 2.4.3 Mutual Inductance Approach......Page 55 2.4.4 Numerical Approach......Page 57 2.4.5 Measurement- Based Model......Page 59 2.5.1 Low- Resistivity Substrates......Page 66 2.5.2 High- Resistivity Substrates......Page 67 2.6.1 Series and Parallel Representations......Page 71 2.6.2 Network Representations......Page 72 References......Page 73 3 Printed Inductors......Page 78 3.1 Inductors on Si Substrate......Page 79 3.1.1 Conductor Loss......Page 81 3.1.2 Substrate Loss......Page 84 3.1.3 Layout Considerations......Page 85 3.1.4 Inductor Model......Page 86 3.1.5 Q- Enhancement Techniques......Page 90 3.1.6 Stacked- Coil Inductor......Page 101 3.1.7 Temperature Dependence......Page 105 3.2 Inductors on GaAs Substrate......Page 107 3.2.1 Inductor Models......Page 108 3.2.3 Comprehensive Inductor Data......Page 109 3.2.4 Q- Enhancement Techniques......Page 125 3.2.5 Compact Inductors......Page 133 3.2.6 High Current Handling Capability Inductors......Page 137 3.3 Printed Circuit Board Inductors......Page 139 3.4.1 Thin- Film Inductors......Page 142 3.4.2 Thick- Film Inductors......Page 145 3.4.3 LTCC Inductors......Page 147 3.5 Ferromagnetic Inductors......Page 148 References......Page 150 4.1.1 Analytical Expressions......Page 158 4.1.2 Compact High- Frequency Inductors......Page 165 4.2 Bond Wire Inductor......Page 167 4.2.1 Single and Multiple Wires......Page 168 4.2.2 Wire Near a Corner......Page 171 4.2.3 Wire on a Substrate Backed by a Ground Plane......Page 172 4.2.4 Wire Above a Substrate Backed by a Ground Plane......Page 174 4.2.5 Curved Wire Connecting Substrates......Page 175 4.2.7 Maximum Current Handling of Wires......Page 176 4.3.2 Measurement- Based Model for Air Core Inductors......Page 177 4.3.3 Measurement- Based Model for Bond Wires......Page 179 4.4 Magnetic Materials......Page 181 References......Page 182 5.1 Introduction......Page 184 5.2.1 Capacitor Value......Page 186 5.2.4 Temperature Coefficient......Page 187 5.2.7 Series and Parallel Resonances......Page 188 5.2.11 Rated Current......Page 191 5.3.1 Multilayer Dielectric Capacitor......Page 192 5.3.2 Multiplate Capacitor......Page 193 5.4.1 Vertically Mounted Series Capacitor......Page 194 5.4.2 Flat- Mounted Series Capacitor......Page 197 5.4.3 Flat- Mounted Shunt Capacitor......Page 198 5.4.4 Measurement- Based Model......Page 199 5.5.2 Maximum RF Current Rating......Page 202 5.5.3 Maximum Power Dissipation......Page 203 5.6.1 Series and Shunt Connections......Page 206 5.6.2 Network Representations......Page 208 References......Page 209 6 Monolithic Capacitors......Page 212 6.1 MIM Capacitor Models......Page 213 6.1.1 Simple Lumped Equivalent Circuit......Page 214 6.1.2 Coupled Microstrip- Based Distributed Model......Page 215 6.1.3 Single Microstrip- Based Distributed Model......Page 219 6.1.4 EC Model for MIM Capacitor on Si......Page 223 6.1.5 EM Simulations......Page 225 6.2 High- Density Capacitors......Page 227 6.2.1 Multilayer Capacitors......Page 229 6.2.2 Ultra- Thin- Film Capacitors......Page 232 6.2.4 Fractal Capacitors......Page 233 6.2.5 Ferroelectric Capacitors......Page 235 6.3 Capacitor Shapes......Page 237 6.3.1 Rectangular Capacitors......Page 238 6.3.3 Octagonal Capacitors......Page 239 6.4.1 Q- Enhancement Techniques......Page 241 6.4.3 Maximum Power Handling......Page 244 References......Page 248 7 Interdigital Capacitors......Page 250 7.1.1 Approximate Analysis......Page 251 7.1.2 J- Inverter Network Equivalent Representation......Page 256 7.1.3 Full- Wave Analysis......Page 257 7.1.4 Measurement- Based Model......Page 259 7.2.1 Compact Size......Page 260 7.2.2 Multilayer Capacitor......Page 262 7.2.3 Q- Enhancement Techniques......Page 265 7.2.4 Voltage Tunable Capacitor......Page 268 7.3 Interdigital Structure as a Photodetector......Page 270 References......Page 272 8.1 Introduction......Page 274 8.2.1 Power Rating......Page 276 8.2.4 Maximum Working Voltage......Page 277 8.3 Resistor Types......Page 278 8.3.3 Monolithic Resistors......Page 279 8.4 High- Power Resistors......Page 286 8.5 Resistor Models......Page 288 8.5.1 EC Model......Page 289 8.5.2 Distributed Model......Page 290 8.5.3 Meander Line Resistor......Page 291 8.6.2 Electrical Representations......Page 293 8.7 Effective Conductivity......Page 295 References......Page 297 9.1.1 Via Hole Connection......Page 300 9.1.2 Via Hole Ground......Page 302 9.2 Via Hole Models......Page 303 9.2.1 Analytical Expression......Page 304 9.2.2 Quasistatic Method......Page 305 9.2.3 Parallel Plate Waveguide Model......Page 307 9.2.4 Method of Moments......Page 308 9.2.5 Measurement- Based Model......Page 310 9.3 Via Fence......Page 311 9.3.2 Radiation from Via Ground Plug......Page 314 9.5 Via Hole Layout......Page 315 References......Page 317 10.1 Airbridge and Crossover......Page 320 10.2.1 Quasistatic Method......Page 322 10.2.2 Full- Wave Analysis......Page 327 10.3.1 Analytical Model......Page 329 10.3.2 Measurement- Based Model......Page 331 References......Page 336 11 Transformers and Baluns......Page 338 11.1.1 Parameters Definition......Page 339 11.1.2 Analysis of Transformers......Page 340 11.1.3 Ideal Transformers......Page 343 11.1.4 Equivalent Circuit Representation......Page 344 11.1.5 Equivalent Circuit of a Practical Transformer......Page 346 11.1.6 Wideband Impedance Matching Transformers......Page 347 11.2.1 Tapped Coil Transformers......Page 350 11.3 Transmission- Line Transformers......Page 353 11.4 Ferrite Transformers......Page 357 11.5 Parallel Conductor Winding Transformers on Si Substrate......Page 360 11.6 Spiral Transformers on GaAs Substrate......Page 362 11.6.1 Triformer Balun......Page 365 11.6.2 Planar- Transformer Balun......Page 366 References......Page 370 12.1.1 Filters......Page 374 12.1.2 Hybrids and Couplers......Page 377 12.1.3 Power Dividers/ Combiners......Page 391 12.1.4 Matching Networks......Page 393 12.1.5 Lumped- Element Biasing Circuit......Page 398 12.2 Control Circuits......Page 401 12.2.1 Switches......Page 402 12.2.2 Phase Shifters......Page 408 12.2.3 Digital Attenuator......Page 411 References......Page 413 13.1 Introduction......Page 416 13.1.1 Materials......Page 417 13.1.3 Mask Fabrication......Page 422 13.2 Printed Circuit Boards......Page 423 13.2.1 PCB Fabrication......Page 425 13.3 Microwave Printed Circuits......Page 426 13.3.1 MPC Fabrication......Page 428 13.3.2 MPC Applications......Page 429 13.4.1 Thin- Film MICs......Page 431 13.4.2 Thick- Film Technology......Page 433 13.4.3 Cofired Ceramic and Glass- Ceramic Technology......Page 435 13.5 GaAs MICs......Page 437 13.5.1 MMIC Fabrication......Page 439 13.6 CMOS Fabrication......Page 442 13.7 Micromachining Fabrication......Page 445 References......Page 446 14.1.1 Characteristic Impedance and Effective Dielectric Constant......Page 450 14.1.2 Effect of Strip Thickness......Page 452 14.2 Design Considerations......Page 453 14.2.2 Microstrip Losses......Page 454 14.2.3 Quality Factor Q......Page 456 14.2.4 Enclosure Effect......Page 459 14.2.5 Frequency Range of Operation......Page 464 14.2.6 Power- Handling Capability......Page 465 14.3 Coupled Microstrip Lines......Page 477 14.3.1 Even- Mode Capacitance......Page 478 14.3.2 Odd- Mode Capacitance......Page 479 14.3.4 Effective Dielectric Constants......Page 480 14.4 Microstrip Discontinuities......Page 481 14.5.1 Step- in- Width......Page 482 14.5.2 Chamfered Bend......Page 483 14.5.3 T- Junction......Page 484 References......Page 486 Appendix......Page 490 About the Author......Page 492 Index......Page 494 Annotation Due to the unprecedented growth in wireless applications over the past decade, development of low-cost solutions for RF and microwave communication systems has become of great importance. This practical new book is the first comprehensive treatment of lumped elements, which are playing a critical role in the development of the circuits that make these cost-effective systems possible. The books offers you an in-depth understanding of the different types of RF and microwave circuit elements, including inductors, capacitors, resistors, transformers, via holes, airbridges, and crossovers

Due to the unprecedented growth in wireless applications over the past decade, development of low-cost solutions for RF and microwave communication systems has become of great importance. This practical new book is the first comprehensive treatment of lumped elements, which are playing a critical role in the development of the circuits that make these cost-effective systems possible. The books offers you an in-depth understanding of the different types of RF and microwave circuit elements, including inductors, capacitors, resistors, transformers, via holes, airbridges, and crossovers.

A comprehensive treatment of lumped elements for RF and microwave circuits. Supported with illustrations and over 220 equations, it covers the different types of RF and microwave circuit elements, including inductors, capacitors, resistors, transformers, via holes, airbridges and crossovers.