Information Science and Electronic Engineering : Proceedings of the 3rd International Conference of Electronic Engineering and Information Science (ICEEIS 2016), January 4-5, 2016, Harbin, China

Information Science and Electronic Engineering is a collection of contributions drawn from the International Conference of Electronic Engineering and Information Science (ICEEIS 2016) held January 4-5, 2016 in Harbin, China. The papers in this proceedings volume cover various topics, including:- Electronic Engineering- Information Science and Information Technologies- Computational Mathematics and Data Mining- Image Processing and Computer Vision- Communication and Signal Processing- Control and Automation of Mechatronics- Methods, Devices and Systems for Measurement and Monitoring- Engineering of Weapon Systems- Mechanical Engineering and Material Science- Technologies of Processing. The content of this proceedings volume will be of interest to professionals and academics in the fields of Electronic Engineering, Computer Science and Mechanical Engineering Photocurrent characteristics of organic dye copper phthalocyanine transistors / X.C. Liu, Y.Y. Wang, M. Zhu, Y.S. Zhang & Z.Y. Wang -- Current transport mechanism analysis of organic dye copper phthalocyanine thin film transistors / Z.J. Cui, Z.Y. Wang, M. Zhu, Y.S. Zhang & Y.Y. Wang -- Design of a fast transient response output-capacitorless LDO / H. You & L. Sun -- Designing a 12 bit pipeline ADC based on the CMOS process / C.J. Qiu, H.Y. Liu, M.F. Xiang, M.H. Li & L.Y. Li -- Photoelectric properties of organic pigment zinc phthalocyanine Schottky diodes / R.J. Zou, Y.S. Zhang, D.X. Wang, X.Y. Cui, Y. Zhang & Y. Yuan -- On two practical student-oriented auxiliary devices for learner autonomy in English / X.T. Wei -- Digital decimation filter design for Sigma-Delta ADC / M.X. Song, J.W. Li & Z.Q. Guan -- Research on the thermal stability and mechanism of PI/TiO2 nanocomposite film / S.C. Wu & J.H. Yin -- A fault-tolerant routing algorithm for NoC based on 2D Mesh / S.Y. Jiang, S.S. Jiang, G. Luo, Z. Lu & J. Zhou -- 20nm and beyond physical design implementation take PR changes / X.J. He & X.L. Hao -- Research on intelligent control system of greenhouse planting / M.X. Song & C. Sun -- Mechanical properties and toughening mechanism of Csf/SiC ceramic composites / L. Li, H. Tang, P.Z. Dong & F.C. Wang -- Establishment of the IOV technology innovation alliances and its influencing factors / W. Wang & X.J. Jia -- Geometry modeling program implementation of virtual surgery systems / M.N. Wang, N. Yang & Y.M. Liu -- The analysis of Gd/Sm-Mn substitution on the phase composition of strontium ferrite / H.M. Zhang, Z. Wu, Z.W. Yu, L.W. Shan & L.M. Dong -- Fabrication and characteristics analysis of a ZnO thin film transistor / S. Zhao, X.C. Liu, D.X. Wang & Y. Yuan -- A modified non-maximum suppression algorithm / A.L. Wang, C.Y. Hu, X.M. Liu, Y.J. Iwahori & R. Kang The 3rd International Conference of Electronic Engineering and Information Science (ICEEIS2016) was held January 4-5, 2016 in Harbin, P.R. China. This conference is sponsored by Harbin University of Science and Technology. The topics covered at ICEEIS2016 include semiconductor materials, nano materials, mechanical materials, MEMS materials, electronic engineering, and information science.