Heterogeneous Integrations

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc. Front Matter ....Pages i-xxii Overview of Heterogeneous Integrations (John H. Lau)....Pages 1-59 Heterogeneous Integrations on Organic Substrates (John H. Lau)....Pages 61-80 Heterogeneous Integrations on Silicon Substrates (TSV-Interposers) (John H. Lau)....Pages 81-111 Heterogeneous Integrations on Silicon Substrates (Bridges) (John H. Lau)....Pages 113-139 Fan-Out Wafer/Panel-Level Packaging for Heterogeneous Integrations (John H. Lau)....Pages 141-191 Heterogeneous Integrations on Fan-Out RDL Substrates (John H. Lau)....Pages 193-204 Heterogeneous Integration of PoP (John H. Lau)....Pages 205-219 Heterogeneous Integration of Memory Stacks (John H. Lau)....Pages 221-256 Heterogeneous Integration of Chip-to-Chip Stacks (John H. Lau)....Pages 257-290 Heterogeneous Integration of CIS, LED, MEMS, and VCSEL (John H. Lau)....Pages 291-353 Trends in Heterogeneous Integrations (John H. Lau)....Pages 355-361 Back Matter ....Pages 363-368