راهنمای مواد با دی الکتریک پایین و بالا و کاربردهای آن‌ها، جلد ۲

Table of Contents missing.Recent developments in microelectronics technologies have created a great demand for interlayer dielectric materials with a very low dielectric constant. They will play a crucial role in the future generation of IC devices (VLSI/UISI and high speed IC packaging). Considerable efforts have been made to develop new low as well as high dielectric constant materials for applications in electronics industries. Besides achieving either low or high dielectric constants, other materials' properties such as good processability, high mechanical strength, high thermal and environmental stability, low thermal expansion, low current leakage, low moisture absorption, corrosion resistant, etc., are of equal importance. Many chemical and physical strategies have been employed to get desired dielectric materials with high performance. This is a rapidly growing field of science--both in novel materials and their applications to future packing technologies. The experimental data on inorganic and organic materials having low or high dielectric constant remail scattered in the literature. It is timely, therfore, to consolidate the current knowledge on low and high dielectric constant materials into a sigle reference source.Handbook of Low and High Dielectric Constant Materials and Their Applications is aimed at bringing together under a sigle cover (in two volumes) all low and high dielectric constant materials currently studied in academic and industrial research covering all spects of inorgani an organic materials from their synthetic chemistry, processing techniques, physics, structure-property relationship to applications in IC devices. This book will summarize the current status of the field covering important scientific developments made over the past decade with contributions from internationally recognized experts from all over the world. Fully cross-referenced, this book has clear, precise, and wide appeal as an essential reference source for all those interested in low and high dielectric constant material Content: Preface , Pages xiii-xv , Hari Singh Nalwa About the Editor , Page xvii List of Contributors , Pages xix-xx List of Contributors , Pages xix-xx Chapter 1 - Low Dielectric Constant Materials for Interlayer Dielectrics , Pages 1-71 , H. Treichel, B. Withers, G. Ruhl, P. Ansmann, R. Würl, Ch. Müller, M. Dietlmeier, G. Maier Chapter 2 - Low Dielectric Constant Glasses and Glass-Ceramics for Electronic Packaging Applications , Pages 73-140 , Prashant N. Kumta, Jin Yong Kim Chapter 3 - Low- k Amorphous Carbon Films for Interconnects of Submicron-Scale Devices , Pages 141-188 , Kazuhiko Endo, Yoshihisa Matsubara Chapter 4 - Cyanate Ester Resins with Low Dielectric Properties and Applications , Pages 189-212 , Arthur W. Snow, Leonard J. Buckley Chapter 5 - Low Dielectric Constant Epoxy Resins , Pages 213-240 , Ichiro Ogura Chapter 6 - Chemical Mechanical Polishing of Organic Polymeric Materials for IC Applications , Pages 241-273 , Dan Towery, Michael A. Fury Chapter 7 - Dielectric Spectroscopy of Crystalline Polymers and Blends , Pages 275-327 , Douglass S. Kalika Chapter 8 - Metallophthalocyanines as High-Dielectric Constant Materials , Pages 329-427 , Neelam Phougat, Padma Vasudevan, Hari Singh Nalwa Chapter 9 - Synthesis of Dielectric Ceramic Materials , Pages 429-455 , Paolo Nanni, Massimo Viviani, Vincenzo Buscaglia Chapter 10 - Ferroelectric Materials Based on Lead Titanate , Pages 457-499 , L. Pardo, J. Ricote, M. Algueró, M.L. Calzada Chapter 11 - Dielectric Behavior in Liquids: Critical Mixtures and Liquid Crystals , Pages 501-561 , Jan Thoen, Tapan K. Bose Chapter 1 - Rapid Photothermal Processing of Dielectrics , Pages 1-59 , R. Singh, V. Parihar Chapter 2 - Size Effects in Ferroelectric Ceramics , Pages 61-112 , E.K. Akdogan, M.R. Leonard, A. Safari Chapter 3 - Physical and Metallorganic Chemical Vapor Deposition of Ferroelectric Thin Films for Nonvolatile Memories , Pages 113-136 , Orlando Auciello, Chris M. Foster, Rammamoorthy Ramesh Chapter 4 - Electrical Aging and Breakdown in Dielectric Materials , Pages 137-207 , G. Blaise, W.J. Sarjeant Chapter 5 - Pyroelectric and Nonlinear Dielectric Properties of Copolymers of Vinylidene Fluoride and Trifluoroethylene , Pages 209-287 , Bernd Ploss Chapter 6 - Dielectric Spectroscopy of Polar and Nonpolar Polymers , Pages 289-316 , D.K. Das-Gupta, P.C.N. Scarpa Chapter 7 - Polymer Laminate Structures , Pages 317-378 , W.J. Sarjeant, G. Blaise, K.J. Bickford, T.E. Springer, T.R. Burkes, G.H. Mauldin, G.J. Rohwein, J. Zirnheld Chapter 8 - Piezocomposite Design, Manufacture, and Applications , Pages 379-421 , James F. Tressler, Thomas R. Howarth Chapter 9 - Capacitors—Past, Present, and Future , Pages 423-491 , W.J. Sarjeant, J. Zirnheld, F.W. MacDougall, J.S. Bowers, N. Clark, I.W. Clelland, R.A. Price, M. Hudis, I. Kohlberg, G. McDuff, I. McNab, S.G. Parler Jr., J. Prymak Chapter 10 - Ceramic Dielectrics for Microwave Applications , Pages 493-532 , Stuart Penn, Neil Alford Index for Volume 1 , Pages 563-569 Index for Volume 2 , Pages 533-539 Recent developments in microelectronics technologies have created a great demand for interlayer dielectric materials with a very low dielectric constant. They will play a crucial role in the future generation of IC devices (VLSI/UISI and high speed IC packaging). Considerable efforts have been made to develop new low as well as high dielectric constant materials for applications in electronics industries. Besides achieving either low or high dielectric constants, other materials' properties such as good processability, high mechanical strength, high thermal and environmental stability, low thermal expansion, low current leakage, low moisture absorption, corrosion resistant, etc., are of equal importance. Many chemical and physical strategies have been employed to get desired dielectric materials with high performance. This is a rapidly growing field of science--both in novel materials and their applications to future packing technologies. The experimental data on inorganic and organic materials having low or high dielectric constant remail scattered in the literature. It is timely, therfore, to consolidate the current knowledge on low and high dielectric constant materials into a sigle reference source.

Handbook of Low and High Dielectric Constant Materials and Their Applications is aimed at bringing together under a sigle cover (in two volumes) all low and high dielectric constant materials currently studied in academic and industrial research covering all spects of inorgani an organic materials from their synthetic chemistry, processing techniques, physics, structure-property relationship to applications in IC devices. This book will summarize the current status of the field covering important scientific developments made over the past decade with contributions from internationally recognized experts from all over the world. Fully cross-referenced, this book has clear, precise, and wide appeal as an essential reference source for all those interested in low and high dielectric constant material. Recent developments in microelectronics technologies have created a great demand for interlayer dielectric materials with a very low dielectric constant. They will play a crucial role in the future generation of IC devices (VLSI/UISI and high speed IC packaging). Considerable efforts have been made to develop new low as well as high dielectric constant materials for applications in electronics industries. Besides achieving either low or high dielectric constants, other materials' properties such as good processability, high mechanical strength, high thermal and environmental stability, low thermal expansion, low current leakage, low moisture absorption, corrosion resistant, et cetera, are of equal importance. Many chemical and physical strategies have been employed to get desired dielectric materials with high performance. This is a rapidly growing field of science--both in novel materials and their applications to future packing technologies. The experimental data on inorganic and organic materials having low or high dielectric constant remail scattered in the literature. It is timely, therfore, to consolidate the current knowledge on low and high dielectric constant materials into a sigle reference source. Handbook of Low and High Dielectric Constant Materials and Their Applications is aimed at bringing together under a sigle cover (in two volumes) all low and high dielectric constant materials currently studied in academic and industrial research covering all spects of inorgani an organic materials from their synthetic chemistry, processing techniques, physics, structure-property relationship to applications in IC devices. This book will summarize the current status of the field covering important scientific developments made over the past decade with contributions from internationally recognized experts from all over the world. Fully cross-referenced, this book has clear, precise, and wide appeal as an essential reference source for all those interested in low and high dielectric constant material V. 1. Materials And Processing -- V. 2. Phenomena, Properties, And Applications. Edited By Hari Singh Nalwa. Includes Bibliographical References And Indexes.