Handbook of industrial inkjet printing : a full system approach : volume 1 et 2

Unique in its integration of individual topics to achieve a full-system approach, this book addresses all the aspects essential for industrial inkjet printing. After an introduction listing the industrial printing techniques available, the text goes on to discuss individual topics, such as ink, printheads and substrates, followed by metrology techniques that are required for reliable systems. Three iteration cycles are then described, including the adaptation of the ink to the printhead, the optimization of the ink to the substrate and the integration of machine manufacturing, monitoring, and data handling, among others. Finally, the book summarizes a number of case studies and success stories from selected areas, including graphics, printed electronics, and 3D printing as well a list of ink suppliers, printhead manufacturers and integrators. Practical hints are included throughout for a direct hands-on experience. Invaluable for industrial users and academics, whether ink developers or mechanical engineers, and working in areas ranging from metrology to intellectual property. fmatter 1 Handbook of Industrial Inkjet Printing: A Full System Approach -1 Contents 5 Introduction 29 Part One: Pros and Cons of Inkjet Technology 31 Part Two: Inks 31 Part Three: Inkjet Printhead Technology 31 Part Four: Substrates 32 Part Five: Metrology 32 Part Six: Data Flow 32 Part Seven: Machine Integration 32 Part Eight: Pre- and Postprocesses 33 Part Nine: Printing Strategies 33 Part Ten: Application Development 33 Part Eleven: Successful Implementations and Case Studies 33 Glossary 34 ch1 35 Part One: Pros and Cons of Inkjet Technology 35 1: Pros and Cons of Inkjet Technology in Industrial Inkjet Printing 37 ch2 41 2: Comparing Inkjet with Other Printing Processes and Mainly Screen Printing 41 2.1 Comparing Inkjet with Screen Printing 45 2.2 Screen Printing Principles and Capabilities 47 2.3 Variants of Screen Printing Techniques 48 2.4 Controlling Layer Thickness 50 2.5 Achievable Resolution 51 2.6 Application Examples 52 2.6.1 Printed Antennae 52 2.6.2 Printed Batteries 52 2.6.3 Fine Line Printing 53 2.7 Conclusion and Further Sources of Information 54 References 55 ch3 56 Part Two: Inks 56 3: A System Approach to Develop New Platforms of Industrial Inkjet Inks 58 3.1 Introduction 58 3.2 Ink Technologies for Industrial Inkjet 59 3.2.1 Aqueous 60 3.2.2 Solvent 61 3.2.3 Oil 62 3.2.4 Hot Melt 63 3.2.5 Energy-Curable 63 3.2.6 Hybrids 64 3.2.7 Choosing an Ink Type 64 3.3 Ink Characterization Methods 64 3.3.1 Overview of Fluid Measurements 66 3.3.1.1 Viscosity 66 3.3.1.2 Surface Tension 66 3.3.1.3 Particle Size 66 3.3.1.4 Sedimentation 67 3.3.1.5 Other Properties 68 3.3.2 Examples of Dried Ink Evaluation 69 3.3.2.1 Color 69 3.3.2.2 Adhesion 69 3.3.2.3 Mechanical Resistance 70 3.3.2.4 Fluid Resistance/Compatibility 70 3.3.2.5 Weathering and Other Stress Tests 70 3.4 Printhead Evaluation 71 3.4.1 Equipment 71 3.4.1.1 Ink Supply 71 3.4.1.2 Drop Viewing 72 3.4.2 Drop Visualization in Practice 72 3.4.2.1 Drop Velocity Determination 73 3.4.2.2 Waveform Basics 73 3.4.2.3 Frequency Dependence 74 3.4.3 Jetting Sustainability 75 3.4.3.1 Manual Methods 75 3.4.3.2 Automated Methods 76 3.4.4 Nozzle Latency/Open Time 76 3.5 Print Process Factors 77 3.5.1 Surface Wetting 77 3.5.1.1 Contact Angle Testing 78 3.5.1.2 Pretreatment 78 3.5.1.3 Print Evaluation Methods 79 3.5.2 Ink-Ink Interactions 80 3.5.3 Drying Considerations 80 3.6 Case Study: Hybrid Aqueous-UV 81 3.6.1 Ink Concept Introductions 81 3.6.2 Head Interactions: Latency 82 3.6.2.1 Head Design Comparisons 82 3.6.2.2 Influence of Waveform 84 3.6.2.3 Ink Recirculation 84 3.6.2.4 Managing Nozzle Health 86 3.6.3 Head Interactions: Sustainability 87 3.6.4 Substrate Interactions 88 3.6.4.1 Substrate and Ink Comparisons 88 3.6.4.2 Print Process Factors 89 3.6.5 Outlook 89 References 90 ch4 92 4: Photoinitiators 92 4.1 Historical Background 92 4.2 Photoinitiators 93 4.2.1 Photoinitiators for UV Radical Curing 95 4.2.1.1 Type I Photoinitiators 97 4.2.1.2 Type II Photoinitiators 111 4.2.1.3 Type II Photoinitiators: Photoinitiators with Type I and Type II Functionality 117 4.2.1.4 Type II Photoinitiators: Coinitiators 118 4.2.2 Photoinitiators for Special Applications 119 4.2.2.1 Low-Migration Food Packaging 119 4.2.2.2 UV LED Curing 137 4.2.2.3 Water-Based UV Inkjet 141 References 144 ch5 150 5: UV Radiation Sources and UV Radiation Measurement 150 5.1 UV Radiation and Energy 150 5.2 UV Radiation Sources 151 5.2.1 Medium-Pressure Mercury Lamp 152 5.2.2 Doped Medium-Pressure Mercury Lamp 153 5.2.3 UV LED 155 5.3 UV Radiation Measurement 156 References 161 ch6 162 6: UV-Curable Inkjet Inks and Their Applications in Industrial Inkjet Printing, Including Low-Migration Inks for Food Packaging 162 6.1 UV Inks for Industrial Applications 162 6.2 UV Curing Process and UV Inkjet Ink Types 163 6.3 UV Inkjet Ink Requirements 165 6.4 UV Inkjet Ink Compounds and Ink Formulations 167 6.5 UV Inkjet Ink Production 171 6.6 Application of UV Inks in Industrial Print Systems 172 6.6.1 Marking and Coding 174 6.6.2 Product Printing 174 6.6.3 Label Printing 175 6.6.4 Packaging 175 6.6.5 Interior Decoration 175 6.7 Low-Migration Inkjet Inks for Migration-Sensitive Applications 175 References 181 ch7 184 7: Ceramic Inkjet Inks 184 7.1 Introduction 184 7.1.1 Industrial Ceramic Process 184 7.1.2 Digital Ceramic Decoration 184 7.2 Ceramic Ink Characteristics 185 7.2.1 Liquid Fraction 185 7.2.2 Solid Fraction 186 7.2.2.1 Pigments 186 7.2.2.2 Others 187 7.3 Ink Properties 187 7.3.1 Viscosity 188 7.3.2 Surface Tension 189 7.3.3 Density 189 7.3.4 Other Properties 189 7.3.4.1 Filtration Time 189 7.3.4.2 Color/Effect 189 7.4 Shelf Life and Storage 189 7.5 Printing 190 7.5.1 Glaze/Ink Interaction 190 7.5.1.1 Interaction before Firing 190 7.5.1.2 Interaction during Firing 191 7.6 Safety Considerations 193 ch8 195 8: Aqueous Inks and Their Application Areas in Industrial Inkjet Printing and Desktop Printing 195 8.1 Introduction 195 8.2 Dye-Based Inks 199 8.2.1 Inks with Dyes as Colorants 199 8.2.1.1 Background 199 8.2.1.2 Process 200 8.2.1.3 Dyes and Inks 200 8.2.2 Reactive Dye Inks 201 8.2.2.1 Background 201 8.2.2.2 Process 202 8.2.2.3 Inks and Dyes 202 8.2.3 Disperse Dye Inks 202 8.2.3.1 Dye Sublimation Inks 204 8.3 Inks with Pigments as Colorants 204 8.3.1 Nonfunctional Pigment Inks 205 8.3.1.1 Background 205 8.3.1.2 Processing 205 8.3.2 Pigment Inks with Emulsion Polymers: Latex Inks 205 8.3.2.1 Background 205 8.3.2.2 Processing 206 8.3.2.3 Inks and Pigments 207 8.4 Other Aqueous Inks 208 8.5 Summary and Outlook 208 References 208 ch9 210 9: Dye Sublimation Inkjet Inks and Applications 210 9.1 Overview 210 9.2 Introduction 210 9.3 Major Advantages of Sublimation Imaging 212 9.4 Sublimation Colorants in Digital Imaging 213 9.5 Ink, Transfer Media, and Substrate 215 9.6 Color Considerations 218 9.7 Major Engineering Aspects 219 9.8 Major Development Opportunities 222 9.9 Summary 224 References 224 ch10 226 10: A Full-System Approach to Formulation of Metal Nanoparticle Inks for Industrial Inkjet Printing 226 10.1 Introduction Inks 226 10.2 Development and Manufacturing of Functional Particles and Inks 226 10.2.1 Synthesis of Metal Nanoparticles for Functional Inks: Comparison of Available Methods 227 10.2.2 Formulation and Application of Functional Inks 230 10.2.2.1 Formulation Additives 230 10.3 Characterization of Fluid Systems and Printed Patterns 231 10.3.1 Physical and Chemical Characterization of Inks 231 10.3.2 Physical and Electrical Characterization of Printed Patterns 234 10.3.2.1 Topography Measurement 236 10.3.2.2 Resistance and Resistivity 236 10.4 Reliability Characterization 243 10.5 Summary 244 References 244 ch11 245 11: Metal Nanoparticle Conductive Inks for Industrial Inkjet Printing Applications 245 11.1 Introduction 245 11.2 Results and Discussion 246 11.2.1 Conductive Ink 246 11.2.2 Inkjet Printing 248 11.3 Conclusions 252 References 252 ch12 254 12: Organic Light-Emitting Diode (OLED) and Quantum Dot (QD) Inks and Application 254 12.1 OLED Basics 254 12.2 Inkjet Printing of OLED Devices 254 12.2.1 Substrate and Pretreatment for Inkjet Printed OLEDs 254 12.2.1.1 Bottom Emitting OLEDs with Thin, Transparent Electrodes such as Indium Tin Oxide (ITO) 254 12.2.1.2 An Alternative to ITO: A Grid Structure and a Conductive Polymer 256 12.2.2 Inkjet Printed PEDOT:PSS Layers 257 12.2.3 Inkjet Printed Layers Based on Emissive Polymers 259 12.2.4 Example of a Printed OLED Security Feature 261 12.3 QD Basics 262 12.3.1 Inkjet Printing of QLED Devices 264 12.3.2 Inkjet Printing of QDs on Paper 264 References 265 ch13 267 Part Three: Inkjet Printhead Technology 267 13: Concepts and Strategies to Adapt Inkjet Printing to Industrial Application Requirements 269 13.1 Introduction 269 13.2 Legacy Products 269 13.3 Establishing New Technologies 269 13.3.1 MEMS Technology 270 13.3.2 VersaDrop 270 13.4 Q-Class Delivers New Technologies to Market 271 13.5 RediJet: An Innovative New Technology 272 13.6 StarFireTM SG1024/C: A Direct Response 273 13.7 StarFireTM SG1024/A: Built on Success 274 13.8 Samba: Embracing Printhead Technologies 274 13.9 Key Samba Technologies 275 13.9.1 Sputtered Nb-PZT Film 275 13.9.2 Nonwetting Coatings 275 13.10 Looking Forward 276 13.11 Printhead Offerings 277 ch14 280 14: Konica Minolta's Inkjet Printhead Technology 280 14.1 Early History 280 14.1.1 Type 204 Printhead 281 14.1.2 512 Series 282 14.1.3 KM1024 289 14.1.4 KM1024i 290 14.1.5 KM1800i 293 14.2 Strengths 294 14.2.1 KM Printhead Strengths 294 14.2.2 Reliability 294 14.2.3 Quality 298 14.2.4 Consistency 299 14.2.5 Life 300 14.2.6 Alignment 304 14.3 Markets and Geography 305 14.4 Future Direction 307 ch15 312 15: Xaar's Inkjet Printing Technology and Applications 312 15.1 Xaar Company Introduction 312 15.2 Bulk Technology 312 15.2.1 Piezoelectric Shear Mode and Shared Wall Technology 312 15.2.2 Monolithic Cantilever Architecture 314 15.2.3 Chevron Architecture 316 15.3 Three-Cycle Acoustic Firing 316 15.3.1 Cycles, Phases, and Grayscale 316 15.3.2 Waveforms 318 15.3.3 Additional Waveform Features 320 15.4 Hybrid Side Shooter Architecture: Xaar 1001 Family 322 15.5 Edge-Mounted Side Shooter Architecture: Xaar 501 Family 323 15.6 Ink Recirculation (TF) Technology 324 15.6.1 Hydra Ink Supply 326 15.7 Print Bar System 327 15.8 MEMS Drop Ejectors with Thin Film Piezoelectric Actuators 328 15.8.1 Xaar's 5601 MEMS Drop Ejector 328 15.8.2 Xaar's 5601 Printhead 331 15.9 New Inkjet Applications and Development 333 15.10 Summary 336 References 337 ch16 339 16: Hewlett Packard's Inkjet Printhead Technology 339 16.1 Fundamentals of Inkjet Printing 339 16.1.1 Overview of Inkjetting and Continuous Inkjet (CIJ) 339 16.1.2 Piezoelectric Inkjetting 341 16.1.3 Thermal Inkjetting 342 16.1.4 Other Forms of Inkjetting 345 16.2 Evolution of the Number of Nozzles 345 16.3 Current/Future Improvements: Page-Wide Printing 346 16.4 Inkjetting for Other Processes 347 16.5 A Possible Future of Inkjet in Custom and Surface Manufacturing 348 16.6 Case Study: HP PageWide Array 352 16.6.1 Specifics of the TIJ Technology 352 16.6.2 Printhead Design 353 16.6.3 Drop Formation Process 355 16.6.4 Application Areas 357 References 357 ch17 360 17: Memjet's Inkjet Printhead Technology and Associated Printer Components 360 17.1 A History of Innovation 360 17.2 The Memjet Printing System 360 17.3 The Technical History of Memjet 361 17.4 The Memjet Printhead 361 17.5 Manufacturing the Memjet Printhead 363 17.6 Designed for Success 364 17.7 Balancing Cost vs. Performance 366 17.8 Memjet Inks 367 17.9 A Holistic Approach to Printing Systems 367 17.10 Memjet in the Marketplace 368 17.11 Future Innovations for Ink and Printheads 371 17.12 Continuing to Set the Standard 372 References 373 ch18 375 18: KODAK's Stream Inkjet Technology 375 18.1 Introduction 375 18.2 Principle of Operation 375 18.3 MEMS Technology-Based Printheads 378 18.4 Scalable Technology 378 18.5 Image Quality 379 18.5.1 Dot Size and Resolution 379 18.5.2 Color Gamut 380 18.5.3 Image Registration and Artifact Detection 380 18.6 Ink Technology 381 18.7 Substrates 382 18.8 The Future of Stream Technology 383 References 383 ch19 385 Part Four: Substrates 385 19: Paper and Paper-Based Substrates for Industrial Inkjet Printing 387 19.1 Definition of Paper 387 19.2 Properties of Paper 388 19.2.1 Bulk Properties 388 19.2.2 Wetting and Surface Properties 390 19.2.3 Porosity and Ink Penetration 390 19.2.4 Physical-Chemical Interaction of Inks with the Paper 391 19.3 Coated Paper, Coating Types, and Surface Properties 392 19.3.1 Porous Coatings 392 19.3.2 Film Coatings 393 19.3.3 Laminates and Composites 393 References 394 ch20 396 20: Polymeric Nonabsorbing Substrates for Industrial Inkjet Printing Applications 396 20.1 Materials: Chemical Composition, Manufacturing Process 396 20.1.1 Polymer Types 396 20.2 Film Manufacturing 400 20.2.1 Film Casting and Extrusion Processes 400 20.2.2 Film Surface Tension and Surface Tension Modification 401 20.3 Material Properties: Chemical, Thermal, Mechanical, Optical, Eco-Environmental 403 20.3.1 Chemical Properties 404 20.3.2 Thermal Properties 404 20.3.3 Mechanical Properties 406 20.3.4 Electrical and Optical Properties 407 20.3.5 Environmental Effects and Durability 409 20.3.6 Barrier Properties 410 20.4 Long-Term Durability and Recycling 411 References 412 ch21 414 21: Glass Substrates for Industrial Inkjet Printing Applications 414 21.1 Introduction: Glass a Universal Material 414 21.2 Glass Types and Main Characteristics 414 21.3 Manufacturing Process 415 21.3.1 Conventional Technology 416 21.3.2 Thin Glass Technology 416 21.4 Physical and Chemical Properties 416 21.4.1 Geometrical Properties 418 21.4.2 Enhanced Glass Strength 418 21.4.3 Glass Surface Properties 419 21.5 Surface Treatments 419 21.5.1 Determination of Surface Quality 419 21.5.2 Surface Treatment Methods to Clean a Surface 421 21.5.3 Surface Cleaning and Coating for Touchscreen Application 423 21.6 Glass Material 424 21.6.1 Optical Glass 424 21.6.2 MEMpax® 425 21.6.3 AF 32® Eco Thin Glass 425 21.6.4 D 263® T Eco Thin Glass 425 21.6.5 B 270® i Ultrawhite Glass 427 21.6.6 Glass Ceramic 427 21.6.7 Photosensitive Glass 428 21.7 Structuring 428 References 430 ch22 431 Part Five: Metrology 431 22: Measurement of Complex Rheology and Jettability of Inkjet Inks 433 22.1 Introduction 433 22.2 Ink Flow Behavior 435 22.3 Bulk and Dynamic Ink Properties 436 22.3.1 Surface Tension 436 22.3.2 Viscoelasticity 437 22.3.3 Other Properties 438 22.4 Complex Rheology Characterization Tools at Jetting Conditions 438 22.4.1 Steady Shear Rheometers 439 22.4.2 High-Frequency Rheometers 439 22.4.3 Extensional Rheometers 440 22.5 Selective Selection of Additives to Optimize Complex Rheology during Ink Formulations 445 22.6 Correlation of Complex Rheology with Jetting Behavior 447 22.6.1 Continuous Inkjet (CIJ) 447 22.6.2 Drop-on-Demand Inks 450 22.7 Conclusions 450 References 451 ch23 453 23: Printhead Health in Industrial Inkjet Printing: In-Line and Off-Line Detection of Poor Drop Formation 453 23.1 Introduction 453 23.2 Failure Origins 454 23.2.1 Introduction 454 23.2.2 Meniscus Consistency 454 23.2.3 Nozzleplate Wetting 455 23.2.4 Satellite Drops 456 23.2.5 Air Bubbles 457 23.3 Sensing 457 23.3.1 Acoustic Sensing, Paint 457 23.3.2 Capacitive Sensing 458 23.3.3 Impedance Spectroscopy 459 23.3.4 Monitoring Droplet Formation 460 23.4 Feedforward Control 463 References 464 ch24 466 24: Quantitative Assessment of Inkjet Reliability under Industrial Conditions: Measuring All Drops during Extended High-Duty Printing 466 24.1 Summary 466 24.2 Idea and Experimental Setup 467 24.3 Theoretical Considerations 468 24.4 Analysis Algorithm 470 24.4.1.1 Robustness to Nozzle Position Variation 471 24.4.1.2 Low Contrast Optimization 472 24.4.1.3 Histogram Matching 472 24.4.1.4 Summary of the Preflight Techniques 474 24.4.1.5 Analysis of the Droplet Presence 475 24.4.2 Computing Time 477 24.4.3 Conclusion 478 References 478 ch25 480 25: In-Line Resistance and Temperature Measurement of Conductive Inks 480 Reference 482 ch26 483 Part Six: Data Flow 483 26: Data Handling in Industrial Inkjet Printing 485 26.1 The Extent of Data 485 26.2 Preparing for the Data 486 26.2.1 Using the Data 486 Reference 487 ch27 488 Part Seven: Machine Integration 488 27: System Approach: An Integrator's Advice on a System Approach for Industrial Inkjet Implementations 490 27.1 System Approach 490 27.2 The Demonstrator Fail 491 27.3 Automate the Right Process 491 27.4 Early Total Cost of Ownership 492 27.5 Chemical Compatibility 493 27.6 Pressures: Wanted and Unwanted 494 27.7 Temperature Affects Not Just the Fluid 496 27.8 Ink Systems 497 27.9 Maintenance Systems 499 27.10 Motion Systems 500 27.10.1 Speed 500 27.10.2 Wobble 501 27.10.3 Encoder 502 27.10.4 Printhead 502 27.11 Preprocesses 503 27.12 Postprocesses 504 27.13 Electronics and Software 504 27.14 Humans Are Part of the Total System 506 27.15 A Small System Approach Example: To Pin or Not to Pin 506 27.16 Be Not Afraid of the System But Use It 507 Reference 507 ch28 508 28: Inkjet Platforms for Functional Material Applications: Modular Integration of Industrial Production Processes 508 28.1 Introduction 508 28.1.1 Simultaneous Application to Different Industries 508 28.2 Role of the Integrator 509 28.3 Inkjet is Complex: There Is No ``Best for Anything ́ ́ 509 28.4 Important Aspects of Realizing an Inkjet Process 511 28.4.1 Choice of the Printhead 512 28.4.1.1 Material Compatibility 512 28.4.1.2 Recirculating Printhead? 513 28.4.1.3 Rheology 513 28.4.1.4 Availability 513 28.4.1.5 Resolution and Minimal Feature Size 513 28.4.1.6 Productivity 515 28.4.1.7 Specific Pattern Requirements 515 28.4.2 Print Strategy 516 28.4.2.1 Pattern Generation and Adaptation of Print Direction 516 28.4.2.2 Printing onto a Substrate Grid 517 28.4.2.3 Dosing Applications 518 28.4.2.4 Process Evaluation 518 28.4.2.5 Preprocessing 518 28.4.2.6 Postprocessing 519 28.4.2.7 Jetting Evaluation 520 28.5 Platform Design 520 28.5.1 Precision and Repeatability 521 28.5.2 Nozzle Calibration 521 28.5.3 Modular Engineering 521 28.5.4 Platform Layout 521 28.5.5 Print Stage 521 28.5.5.1 Substrate Fixation 521 28.5.5.2 Substrate Temperature 521 28.5.5.3 Adaptation of Print Direction 522 28.5.6 Process Unit 522 28.5.7 Ink Supply System 522 28.5.7.1 Static Ink Supply 523 28.5.7.2 Recirculating Ink Supply 523 28.5.7.3 Size and Refill Concept 523 28.5.8 Drop Formation Analysis 523 28.5.9 Maintenance 523 28.5.10 Environment 524 28.5.11 Automation 524 28.6 Complexity and Performance 525 Reference 525 ch29 526 Part Eight: Pre- and Postprocesses 526 29: Surface Pretreatment for Wettability Adjustment 528 29.1 Substrate Surface Condition Matters! 528 29.1.1 Ever Tried to Paint a Wax Candle? 528 29.1.2 Describing Surface Properties 529 29.1.3 Some Facts About Cleanliness of Supplied Substrates 529 29.1.4 Test Methods for Surface Activity 530 29.1.4.1 Test Inks 530 29.1.4.2 Contact Angle Test 530 29.2 Surface Pretreatment Methods 531 29.2.1 The Gentle Power of the Fourth Aggregate State and How Does Plasma Work? 531 29.2.2 A Brief Excursion into Chemistry and Physics of the Plasma Reaction 532 29.2.3 Methods for Surface Pretreatment: Cleaning and Activation 534 29.2.3.1 Vacuum or Low-Pressure Plasma: Chemical Energy without Heat Load 534 29.2.3.2 Corona and Atmospheric Plasma 534 29.2.3.3 Flame Treatment 535 29.2.3.4 UV Ozone Treatment 536 29.3 Industrial Use of Surface Pretreatment 537 29.3.1 Corona 537 29.3.2 Atmospheric Plasma 538 29.3.3 Vacuum Plasma (or Low-Pressure Plasma) 540 29.3.3.1 Plasma Cleaning 541 29.3.3.2 Plasma Activation (or Plasma Modification, Plasma Conditioning) 542 29.3.3.3 Other Terms for Plasma Processing 543 29.4 Choosing the Right Pretreatment Method 544 29.4.1.1 Geometry of Parts and Substrates 544 29.4.2 Process Gas Limitations 544 29.4.3 Process Temperature Limitations 545 29.5 Shelf Life 546 29.6 Summary 547 ch30 548 30: UV LED Ink Curing: UV LED Technology and Solutions for Integration into Industrial Inkjet Printing 548 30.1 What Is UV LED Curing? 548 30.2 UV LED Technology Components 548 30.2.1 LEDs: The Base Building Block 549 30.2.2 Array: Grouping of LEDs 550 30.2.3 Cooling: Thermal Management 551 30.2.4 Optics: Guiding the Light 552 30.3 Emission Spectrum 552 30.3.1 UV-A 552 30.3.2 UV-B and UV-C 553 30.4 Power Specifications 554 30.4.1 Peak Irradiance 554 30.4.2 Power 554 30.4.3 Dose 555 30.4.4 Emitting Window Width 555 30.5 Material Formulation 556 30.6 UV LED Benefits 556 30.7 Markets and Applications 557 30.7.1 Digital Inkjet, Screen, and Flexographic Printing 557 30.7.2 Labels and Packaging 558 30.7.3 Posters and Signage 558 30.7.4 Coding and Marking 558 30.7.5 Container Printing 558 30.7.6 Braille Printing 558 30.7.7 Decoration 558 30.7.8 3D Textured Printing 559 30.8 Integration Considerations 559 30.8.1 Pinning 559 30.8.2 Thermal Management and Aerodynamics 559 30.8.3 Stray Light 560 30.9 Summary and Outlook 560 ch31 562 31: Electron-Beam Processing for Industrial Inkjet Printing: Cross-Linking and Curing 562 31.1 EB Processes 562 31.1.1 Cross-Linking 562 31.1.2 Curing or Drying 563 31.1.3 EB Curing Enhances Product Qualities 563 31.2 Advantages of EB-Processing 563 31.3 Differences between EB and UV Curing 564 31.4 Curing or Drying 564 31.5 Operating Parameters 566 31.5.1 Penetration of Energetic Electrons 566 31.5.2 Dose 566 31.5.3 Dose Rate: Throughput 567 31.5.4 Operation and Maintenance 567 31.5.5 Inerting 568 31.5.6 Energy Consumption 568 31.5.7 Safety/Shielding 568 31.6 The Classic EB Processor 569 31.7 The ebeam Lamp 569 31.8 EB for Inkjet Applications 572 31.8.1 Inkjet EB Inks 574 31.9 Summary 574 Further Reading 575 ch32 576 32: Photonic Curing Enabling High-Speed Sintering of Metal Inkjet Inks on Temperature-Sensitive Substrates 576 32.1 Photonic Curing of Inkjet-Printed Films 576 32.2 Technology Behind Photonic Curing 577 32.3 Inkjet Printing Combined with Photonic Curing 580 32.4 Summary and Conclusions 583 References 584 ch33 586 33: Oven Drying of Inkjet-Printed Functional Fluids on Industrial Scale 586 33.1 Drying Process: How to Open the Black Box 586 33.2 Convective Drying Oven 586 33.3 Convective Drying Process 588 33.3.1 Evaporation 589 33.3.2 Curing and Sintering 589 33.4 Oven Temperatures 590 33.5 Air Flow Speed 591 33.6 Web Temperature 592 33.6.1 Infrared Drying in Support of Convective Heating 593 33.7 Lower Explosion Level (LEL) 593 33.8 Condensation 594 33.9 Contamination Control 594 33.9.1 Ambient Control 596 33.9.2 Web Transport through the Oven 596 33.10 Conclusion 597 ch34 598 Part Nine: Printing Strategies 598 34: Turning Industrial Application Requirements into Real Solutions 600 34.1 Application Development 600 34.2 Productivity 601 34.3 Single-Pass Printing 602 34.3.1 Introduction 602 34.3.2 Drop Size Requirement 602 34.3.3 Drop Placement 604 34.3.4 Placement Error in X 604 34.3.5 Placement Error in Y 606 34.4 Imaging Models 608 34.5 High Standoff Printing 610 34.6 Summary 615 References 616 ch35 617 Part Ten: Application Development 617 35: Inkjet Printing for Printed Electronics 619 35.1 Technology 619 35.1.1 Introduction 619 35.1.2 Production Upscaling 620 35.2 Application Examples 623 35.2.1 Printed Smart Card 623 35.2.2 Inkjet Printing of the Bezel in Touch Panels 624 35.2.3 Multilayer IJP for Smart Labels 627 35.2.4 Inkjet Printed Organic Photovoltaics 628 35.2.5 Inkjet Printing of Two-Colored Organic Light-Emitting Diodes 631 35.3 Conclusions 632 References 633 ch36 635 36: Inkjet-Printed Metal Lines and Sensors on 2D and 3D Plastic Substrates 635 36.1 Introduction 635 36.2 Inkjet Printing of Metal Lines on Injection-Molded Substrates 636 36.2.1 Printing Results 636 36.2.2 Resistance 637 36.2.3 Adhesion 637 36.3 Electrical Connection of Printed Metal Lines 638 36.3.1 Overprinting of Contact Pads 638 36.3.2 Spring Contacts 639 36.3.3 Soldering 639 36.3.4 Isotropic Conductive Adhesive 640 36.4 Inkjet Printing of Metal Lines on 3D Surfaces 640 36.5 Sensors on Injection-Molded Thermoplastic Substrates 642 36.5.1 Temperature Sensor 642 36.5.2 Stress Sensor 643 36.5.3 Touch Sensor 644 36.5.4 Humidity Sensor 645 36.5.5 Fluid-Level Sensor 646 36.5.6 Intrusion Sensor 647 36.5.7 Antennas 648 36.6 Challenges for Commercialization 649 36.7 Summary 650 36.8 About Hahn-Schickard 650 References 650 ch37 653 37: Inkjet and Laser Hybrid Processing: An Enabling Technology for Reliable Production of Fine Interconnects in Large-Area Electronics 653 37.1 M-Solv 653 37.2 Introduction 653 37.3 Hybrid Process Examples 654 37.3.1 Manufacture of Capacitive Touch Screens 654 37.3.2 One-Step Interconnect for Thin Film PV 657 37.3.3 Other Benefits of Hybrid Processes 660 37.3.4 Hybrid Processing Machines and Outlook for the Future 662 37.4 Conclusion 663 References 664 ch38 666 38: Industrial 3D Inkjet Printing/Additive Manufacturing 666 38.1 Overview of Additive Manufacturing 666 38.2 Inkjet as a Commercially Attractive Enabler in Industrial 3D Printing/Additive Manufacturing 666 38.3 Inkjet Printing and Reaction 668 38.3.1 Direct 3D Inkjet Printing 668 38.4 Inkjet Printing to Enable Selective Sintering 671 38.5 Future Outlook for Inkjet in Industrial 3D Printing/Additive Manufacturing 676 References 676 ch39 678 39: Industrial Applications of 3D Inkjet Printing in the Life Sciences 678 39.1 Introduction 678 39.2 Inkjet Printhead Technology 679 39.3 Printing Functional Materials 681 39.4 Inkjet-Based Bioprinting 683 39.5 Commercial Inkjet-Based Bioprinting Technologies 686 39.5.1 Commercial Bioprinting Technologies 686 39.5.2 From Lab to Fab - Scaling Inkjet-Based Bioprinting 688 39.6 Inkjet-Based Drug Discovery 691 39.7 Summary and Outlook 694 References 695 ch40 697 Part Eleven: Successful Implementations and Case Studies 697 40: Inkjet Technology within the Label Converting Market 699 40.1 Inkjet Printing of Labels 699 40.2 Label Functionality 700 40.3 Not Just a Print Process, but a Manufacturing Process 701 40.3.1 Substrates 702 40.4 Converting Processes 705 40.4.1 Unwinding/Rewinding 705 40.4.2 Web Cleaning and Corona Treatment 705 40.4.3 Primer 706 40.4.4 Printing with High Opacity White Ink 707 40.4.5 CMYK Process Printing 708 40.4.6 Spot Color Printing and Emulation 710 40.4.7 Pantone System 711 40.4.8 Gamut 712 40.5 The Advantage of Digital Hybrid 713 40.5.1 Inline Flood Coat and Spot Varnish 714 40.5.1.1 Lamination 716 40.5.2 Peel and Reveal 716 40.5.3 Cold Stamp Foil 716 40.5.4 Metallic Process 717 40.5.5 Spot Colors and Specialist Inks 717 40.6 Models of Converting Using Inkjet 718 40.6.1 Desktop Converting 718 40.6.2 Low Investment 719 40.6.3 Reel to Reel with Offline Finishing 719 40.6.4 Reel to Reel with Inline Finishing 720 40.6.5 Fully Integrated Semirotary or Full Rotary Magnetic Die-Cutting, Slitting, and Sheeting 720 40.6.6 Fully Integrated Laser-Based Finishing 721 40.6.7 Third-Party Finishing Solution 721 40.6.8 Full Hybrid Solution 721 40.6.9 Retrofit Hybrid Solution 722 40.7 The Inkjet Advantage 723 40.8 Market Sectors 724 40.9 Trends in the Industry 724 40.9.1 Reduced Lead Time 724 40.9.2 Reduction in Quantities and Increase in Frequency of Orders 727 40.9.3 Clearer More Transparent Labeling 727 40.9.4 Variable Data 727 40.9.5 More Stringent Guidelines: New Labeling Technologies 728 40.9.6 Anticounterfeiting and Brand Protection 728 40.9.7 Supply Chain Tracking 729 40.9.8 Sustainability and Eco-friendly Materials 729 40.9.9 Shrink/Stretch Sleeve 729 40.10 Creating a Successful Integration 730 40.10.1 Selecting the Right Printhead Technology for the Label Market 730 40.10.2 Qualifying a Head to a Specific Application 730 40.10.3 Factors to Consider When Selecting a Printhead 730 40.10.4 Reliability 731 40.10.5 Viscosity Range 732 40.10.6 Gray Levels and Resolutions 732 40.10.7 Ability to Print Flat Vibrant Colors 734 40.10.8 Uniformity 734 40.10.9 Highlight Detail 735 40.10.10 Smooth Blends 735 40.10.11 Performance 736 40.11 Example of Commercially Available Inkjet Label Press - Graphium 736 Further Reading 738 ch41 739 41: Case Study: Digital Label Converting FFEI Ltd - Graphium 739 41.1 Graphium Digital Hybrid Label Press 739 41.2 Productivity 739 41.2.1 Modular 740 41.2.2 Wide Web Width 740 41.2.3 Automated Cleaning 740 41.2.4 Manipulation of the Crossover 740 41.2.5 Finishing 741 41.2.6 Workflow 741 41.2.7 Print Bar 741 41.3 Reliability 741 41.3.1 Printheads 741 41.3.2 Industrial-Grade Transport System 742 41.4 Easing the Production of Complex Label Designs 742 41.4.1 Combining the Power of Digital with the Versatility of Flexo 742 41.4.2 Substrate Choice 742 41.4.3 Fit-for-Purpose 742 41.4.4 Variable Data 743 41.4.5 Banner Printing 743 41.5 Print Quality 743 41.6 Managing a Hybrid Production System 743 41.7 Intelligent Layout 744 41.7.1 MIS Integration 744 41.7.2 CAD Import 744 41.7.3 Automated Image Matching 744 41.7.4 Rules-Based Step and Repeat 744 41.7.5 Versioned and Ganged Labels 744 41.7.6 Object Specific Optimization 745 41.7.7 Job Container with Multiworkflow Automation 745 41.7.8 Variable Data 745 41.7.9 Wide Range of Supported Devices 745 Handbook of Industrial Inkjet Printing: A Full System Approach -1 ch42 746 42: Case Study Gallus Labelfire 340: Guiding Question to Choose a Hybrid Inline Label Converting System 746 42.1 Summary 751 ch43 752 43: Cylindrical Packaging Decoration: A Breakthrough in Inkjet Technology 752 43.1 Introduction 752 43.2 Background to the Client 752 43.3 Background to IIJ and Konica Minolta Ink Jet Division 753 43.4 The Link with Martinenghi 753 43.5 Ink and UV 756 43.6 Projects and Delivering 757 43.7 Realization of a Dream 760 ch44 762 44: Industrial Inkjet Printing in Decorative Web Print Applications 762 44.1 Introduction 762 44.1.1 History of Décor Paper Printing 762 44.1.2 Markets and Market Sizes 763 44.1.3 Situation and Preview 763 44.2 Technical Description of Décor Printing with Inkjet Printing 763 44.2.1 Décor Paper 763 44.2.2 Applications 766 44.2.2.1 Main Processes 766 44.2.2.2 Products 767 44.2.3 Metamerism 767 44.2.4 Light Shades 767 44.2.5 Selection Criteria for Inkjet Printheads and Inks for Décor Printing 768 44.2.6 What Would Be the Perfect Printhead for a Décor Printing Application? 769 44.2.7 Paper Growth and Ink Type Selection 769 44.2.8 Drying 770 44.2.9 Impregnation 770 44.2.10 Pressing 771 44.3 Applications 771 44.3.1 Printing Applications in Digital Production 771 44.3.1.1 Project Printing Application 771 44.3.1.2 Design Development 771 44.3.1.3 Lab Printing 772 44.3.1.4 Production Printing 772 44.4 Example of an Inkjet-Based Machine for Décor Printing 772 References 774 ch45 775 45: Case Study at TecnoFerrari: Design of a Single-Pass Inkjet Printer for Ceramic Tile Decoration - From Machine Concept to a Complete Solution 775 45.1 Ceramic Tiles Decoration Requirements 775 45.1.1 Background: Ceramic Tiles Manufacturing Process 775 45.1.2 Ceramic Tiles Typology, Sizes, and Glazing Line Speed 777 45.1.3 Ceramic Tiles Pr