Handbook of Cleaning for Semiconductor Manufacturing - Fundamentals and Applications

This comprehensive volume provides an in-depth discussion of the fundamentals of cleaning and surface conditioning of semiconductor applications such as high-k/metal gate cleaning, copper/low-k cleaning, high dose implant stripping, and silicon and SiGe passivation. The theory and fundamental physics associated with wet etching and wet cleaning is reviewed, plus the surface and colloidal aspects of wet processing. Formulation development practices and methodology are presented along with the applications for preventing copper corrosion, cleaning aluminum lines, and other sensitive layers. This is a must-have reference for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing. Provides an In-depth discussion of surface conditioning for semiconductor applications The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications provides an in-depth discussion of surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet processing is reviewed as well as surface and colloidal aspects of cleaning and etching. Topics covered in this new reference include: Front end line (FEOL) and back end of line (BEOL) cleaning applications such as high-k/metal gate post-etch cleaning and pore sealing, high-dose implant stripping and cleaning, and germanium, and silicon passivation Formulation development practices, methodology and a new directions are presented including chemicals used for preventing corrosion of copper lines, cleaning aluminium lines, reclaiming wafers, and water bonding, as well as the filtering and recirculating of chemicals including reuse and recycling Wetting, cleaning, and drying of features, such as high aspect ratio features and hydrophilic surface states, especially how to dry without watermarks, the abilities to wet hydrophobic surfaces and to remove liquid from deep features The chemical reactions and mechanisms of silicon dioxide etching with hydrofluoric acid, particle removal with ammonium hydroxide/hydrogen peroxide mixture, and metal removal with hydrochloric acid The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications is a valuable resource for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing. Engineers working for semiconductor manufacturing, capital equipment, chemicals, or other industries that assures cleanliness of chemicals, material, and equipment in the manufacturing area will also find this handbook an indispensible reference. Fundamentals. Surface and Colloidal Chemical Aspects of Wet Cleaning / Srini Raghavan, Manish Keswani, Nandini Venkataraman The Chemistry of Wet Cleaning / D. Martin Knotter The Chemistry of Wet Etching / D. Martin Knotter Surface Phenomena: Rinsing and Drying / Karen A. Reinhardt, Richard F. Reidy, John A. Marsella Fundamental Design of Chemical Formulations / Robert J. Rovito, Michael B. Korzenski, Ping Jiang, Karen A. Reinhardt Filtering, Recirculating, Reuse, and Recycling of Chemicals / Barry Gotlinsky, Kevin T. Pate, Donald C. Grant Applications. Cleaning Challenges of High-k/Metal Gate Structures / Muhammad M. Hussain, Denis Shamiryan, Vasile Paraschiv, Kenichi Sano, Karen A. Reinhardt High Dose Implant Stripping / Karen A. Reinhardt, Michael B. Korzenski Aluminum Interconnect Cleaning and Drying / David J. Maloney Low-k/Cu Cleaning and Drying / Karen A. Reinhardt, Richard F. Reidy, Jerome Daviot Corrosion and Passivation of Copper / Darryl W. Peters Germanium Surface Conditioning and Passivation / Sonja Sioncke, Yves J. Chabal, Martin M. Frank Wafer Reclaim / Michael B. Korzenski, Ping Jiang Direct Wafer Bonding Surface Conditioning / Hubert Moriceau, Yannick C. Le Tiec, Frank Fournel, Ludovic F. L. Ecarnot, Sebastien L. E. Kerdil̈s, Daniel Delprat, Christophe Maleville New Directions. Novel Analytical Methods for Cleaning Evaluation / Chris M. Sparks, Alain C. Diebold Stripping and Cleaning for Advanced Photolithography Applications / John A. Marsella, Dana L. Durham, Leslie D. Molnar. Content: Front Matter • Introduction • Table of Contents •Part I. Fundamentals 1. Surface and Colloidal Chemical Aspects of Wet Cleaning 2. The Chemistry of Wet Cleaning 3. The Chemistry of Wet Etching 4. Surface Phenomena: Rinsing and Drying 5. Fundamental Design of Chemical Formulations 6. Filtering, Recirculating, Reuse, and Recycling of Chemicals •Part II. Applications 7. Cleaning Challenges of High-κ/Metal Gate Structures 8. High Dose Implant Stripping 9. Aluminum Interconnect Cleaning and Drying 10. Low-κ/Cu Cleaning and Drying 11. Corrosion and Passivation of Copper 12. Germanium Surface Conditioning and Passivation 13. Wafer Reclaim 14. Direct Wafer Bonding Surface Conditioning •Part III. New Directions 15. Novel Analytical Methods for Cleaning Evaluation 16. Stripping and Cleaning for Advanced Photolithography Applications Index