Ferroelectric Dielectrics Integrated on Silicon: Defaÿ/Ferroelectric Dielectrics Integrated on Silicon

This book describes up-to-date technology applied to high-K materials for More Than Moore applications, i.e. microsystems applied to microelectronics core technologies. After detailing the basic thermodynamic theory applied to high-K dielectrics thin films including extrinsic effects, this book emphasizes the specificity of thin films. Deposition and patterning technologies are then presented. A whole chapter is dedicated to the major role played in the field by X-Ray Diffraction characterization, and other characterization techniques are also described such as Radio frequency characterization. An in-depth study of the influence of leakage currents is performed together with reliability discussion. Three applicative chapters cover integrated capacitors, variables capacitors and ferroelectric memories. The final chapter deals with a reasonably new research field, multiferroic thin films.Content: Chapter 1 The Thermodynamic Approach (pages 1–25): Chapter 2 Stress Effect on Thin Films (pages 27–70): Chapter 3 Deposition and Patterning Technologies (pages 71–110): Chapter 4 Analysis Through X?Ray Diffraction of Polycrystalline Thin Films (pages 111–158): Chapter 5 Physicochemical and Electrical Characterization (pages 159–182): Chapter 6 Radio?Frequency Characterization (pages 183–212): Chapter 7 Leakage Currents in PZT Capacitors (pages 213–279): Chapter 8 Integrated Capacitors (pages 281–304): Chapter 9 Reliability of PZT Capacitors (pages 305–340): Chapter 10 Ferroelectric Tunable Capacitors (pages 341–378): Chapter 11 Fram Ferroelectric Memories (pages 379–402): Chapter 12 Integration of Multiferroic BiFeO3 Thin Films into Modern Microelectronics (pages 403–441):

this Book Describes Up-to-date Technology Applied To High-k Materials For More Than Moore Applications, I.e. Microsystems Applied To Microelectronics Core Technologies.

after Detailing The Basic Thermodynamic Theory Applied To High-k Dielectrics Thin Films Including Extrinsic Effects, This Book Emphasizes The Specificity Of Thin Films. Deposition And Patterning Technologies Are Then Presented. A Whole Chapter Is Dedicated To The Major Role Played In The Field By X-ray Diffraction Characterization, And Other Characterization Techniques Are Also Described Such As Radio Frequency Characterization. An In-depth Study Of The Influence Of Leakage Currents Is Performed Together With Reliability Discussion. Three Applicative Chapters Cover Integrated Capacitors, Variables Capacitors And Ferroelectric Memories. The Final Chapter Deals With A Reasonably New Research Field, Multiferroic Thin Films.

In 2008 scientists investigating materials of the perovskite family thought a compendium of research findings to date would be handy, and began conscripting specialists in different aspects. The project bifurcated into two volumes at one stage. Piezoelectric Materials Integrated on Silicon was published in 2011 and focuses on thin piezoelectric films. This volume is more oriented to technological aspects, and considers dielectrics with very high permittivity and ferroelectrics. Among the topics are the thermodynamic approach, deposition and patterning technologies, radio frequency characterization, integrated capacitors, and ferroelectric tunable capacitors. Annotation ©2012 Book News, Inc., Portland, OR (booknews.com)