Electromagnetic Compatibility Engineering

As other reviewers have said, this is a great reference for EMC issues, and I wholeheartedly agree. As an analog engineer, though, I find it extremely valuable for analog design, too. It's not surprising that so many respected analog designers refer to Henry Ott's work. Anyone involved in the design of mixed-signal (analog and digital) printed circuit boards will find a goldmine of information in the chapter covering this topic (Chapter 17: Mixed-Signal PCB Layout). The rationale for using or not using split ground planes is clearly explained, and it is likely that many designers, including this reviewer, have been doing it improperly and creating noisier PCBs that result in noisier analog signals. More often than not, it is better not to split the ground plane, but parts placement is the key. This chapter alone is worth the price of the book. Chapter 4: Balancing and Filtering thoroughly covers the topic of balanced circuits and includes the entire signal chain: the driver, the cable, and the receiver (both transformer-input and op-amp-input based). Anyone working with low-level analog signals (audio engineers, instrumentation engineers) will find this chapter very valuable. Also of great value is the chapter on cabling (Ch. 2). It clearly explains how and under what circumstances cable shielding works to guard against electric and magnetic interference, and the differences between coaxial cable and twisted pair connections. As an engineer working in the audio field, this is a definitive reference for analyzing the performance of single-ended (coax) and balanced ("XLR") audio connections, including the topics of ground loops and how and where to ground the shield of a cable (as is specified in the Audio Engineering Society's standard addressing this, AES48, 2005). Chapter 6: Shielding will provide the information needed to determine if it's even possible to effectively shield a circuit from interference and, if it is possible, what material(s) will do the job and how to design the shield. Many times shielding is added to a design and provides no benefit, but only increases cost; this chapter will help you avoid a bad decision like this. Also, the book is a great reference for many analog engineering topics like calculating the noise in a resistor or op-amp circuit, the differences between ideal and real-world passive components, etc. The book has become a frequent reference for a variety of engineering issues, not just EMC. Getting back to EMC, Chapter 18: Precompliance EMC Measurements -- another wonderful example of Henry Ott's ability to provide clear, concise, practical information to the working engineer -- has numerous examples of simple, straightforward EMC tests that can be performed in a development lab, with reasonably priced test equipment. Without a doubt, you'll save a trip or two (or more!) to an expensive EMC test facility if you use these methods to discover your product's problem areas and fix them before going to a certified EMC test site. Related to this chapter is Appendix B: The Ten Best Ways to MAXIMIZE the Emission from Your Product. It's a quick and entertaining read, but is packed with information for the designer to identify the areas and mistakes very likely to cause EMC problems with a design. These three appendix pages should be read by everyone involved with a project -- electrical engineers, mechanical engineers, and project managers -- to make sure these errors don't make their way into the design. A well-written and immensely useful book, it is very deserving of the 2009 Association of American Publishers award it received. Electromagnetic Compatibility Engineering......Page 5 CONTENTS......Page 9 Preface......Page 25 PART 1 EMC THEORY......Page 29 1.2 Noise and Interference......Page 31 1.3 Designing for Electromagnetic Compatibility......Page 32 1.5.1 FCC Regulations......Page 34 1.5.2 FCC Part 15, Subpart B......Page 36 1.5.3 Emissions......Page 39 1.5.4 Administrative Procedures......Page 42 1.5.6 Medical Equipment......Page 45 1.5.7 Telecom......Page 46 1.6 Canadian EMC Requirements......Page 47 1.7.1 Emission Requirements......Page 48 1.7.2 Harmonics and Flicker......Page 50 1.7.4 Directives and Standards......Page 51 1.8 International Harmonization......Page 54 1.9 Military Standards......Page 55 1.10 Avionics......Page 56 1.12 Typical Noise Path......Page 58 1.13.1 Conductively Coupled Noise......Page 59 1.13.2 Common Impedance Coupling......Page 60 1.14.1 Galvanic Action......Page 61 1.14.3 Triboelectric Effect......Page 63 1.15 Use of Network Theory......Page 64 Summary......Page 66 Problems......Page 67 References......Page 69 Further Reading......Page 70 2. Cabling......Page 72 2.1 Capacitive Coupling......Page 73 2.2 Effect of Shield on Capacitive Coupling......Page 76 2.3 Inductive Coupling......Page 80 2.4 Mutual Inductance Calculations......Page 82 2.5 Effect of Shield on Magnetic Coupling......Page 84 2.5.1 Magnetic Coupling Between Shield and Inner Conductor......Page 86 2.5.2 Magnetic Coupling—Open Wire to Shielded Conductor......Page 89 2.6 Shielding to Prevent Magnetic Radiation......Page 92 2.7 Shielding a Receptor Against Magnetic Fields......Page 95 2.8 Common Impedance Shield Coupling......Page 97 2.9 Experimental Data......Page 98 2.10 Example of Selective Shielding......Page 102 2.12 Coaxial Cable Versus Twisted Pair......Page 103 2.13 Braided Shields......Page 107 2.14 Spiral Shields......Page 109 2.15.1 Pigtails......Page 112 2.15.2 Grounding of Cable Shields......Page 116 2.16 Ribbon Cables......Page 122 Summary......Page 124 Problems......Page 126 References......Page 131 Further Reading......Page 132 3. Grounding......Page 134 3.1 AC Power Distribution and Safety Grounds......Page 135 3.1.1 Service Entrance......Page 136 3.1.2 Branch Circuits......Page 137 3.1.3 Noise Control......Page 139 3.1.4 Earth Grounds......Page 142 3.1.5 Isolated Grounds......Page 144 3.1.6 Separately Derived Systems......Page 146 3.1.7 Grounding Myths......Page 147 3.2 Signal Grounds......Page 148 3.2.1 Single-Point Ground Systems......Page 152 3.2.2 Multipoint Ground Systems......Page 154 3.2.3 Common Impedance Coupling......Page 156 3.2.4 Hybrid Grounds......Page 158 3.2.5 Chassis Grounds......Page 159 3.3 Equipment/System Grounding......Page 160 3.3.2 Clustered Systems......Page 161 3.3.3 Distributed Systems......Page 168 3.4 Ground Loops......Page 170 3.5 Low-Frequency Analysis of Common-Mode Choke......Page 175 3.6 High-Frequency Analysis of Common-Mode Choke......Page 180 3.7 Single Ground Reference for a Circuit......Page 182 Summary......Page 183 Problems......Page 184 Further Reading......Page 185 4.1 Balancing......Page 186 4.1.1 Common-Mode Rejection Ratio......Page 189 4.1.2 Cable Balance......Page 193 4.1.4 Balanced Loads......Page 194 4.2.1 Common-Mode Filters......Page 202 4.2.2 Parasitic Effects in Filters......Page 205 4.3 Power Supply Decoupling......Page 206 4.3.1 Low-Frequency Analog Circuit Decoupling......Page 211 4.3.2 Amplifier Decoupling......Page 213 4.4 Driving Capacitive Loads......Page 214 4.5 System Bandwidth......Page 216 Summary......Page 218 Problems......Page 219 References......Page 220 Further Reading......Page 221 5.1 Capacitors......Page 222 5.1.1 Electrolytic Capacitors......Page 223 5.1.2 Film Capacitors......Page 225 5.1.3 Mica and Ceramic Capacitors......Page 226 5.1.4 Feed-Through Capacitors......Page 228 5.1.5 Paralleling Capacitors......Page 230 5.2 Inductors......Page 231 5.3 Transformers......Page 232 5.4 Resistors......Page 234 5.4.1 Noise in Resistors......Page 235 5.5 Conductors......Page 236 5.5.1 Inductance of Round Conductors......Page 237 5.5.2 Inductance of Rectangular Conductors......Page 238 5.5.3 Resistance of Round Conductors......Page 239 5.5.4 Resistance of Rectangular Conductors......Page 241 5.6 Transmission Lines......Page 243 5.6.1 Characteristic Impedance......Page 245 5.6.2 Propagation Constant......Page 248 5.6.3 High-Frequency Loss......Page 249 5.6.4 Relationship Among C, L and ε(r)·......Page 252 5.7 Ferrites......Page 253 Summary......Page 261 Problems......Page 262 Further Reading......Page 265 6.1 Near Fields and Far Fields......Page 266 6.2 Characteristic and Wave Impedances......Page 269 6.3 Shielding Effectiveness......Page 271 6.4 Absorption Loss......Page 273 6.5 Reflection Loss......Page 277 6.5.1 Reflection Loss to Plane Waves......Page 280 6.5.2 Reflection Loss in the Near Field......Page 281 6.5.3 Electric Field Reflection Loss......Page 282 6.5.4 Magnetic Field Reflection Loss......Page 283 6.5.6 Multiple Reflections in Thin Shields......Page 284 6.6.1 Plane Waves......Page 285 6.6.2 Electric Fields......Page 286 6.6.3 Magnetic Fields......Page 287 6.8 Shielding with Magnetic Materials......Page 288 6.9 Experimental Data......Page 293 6.10 Apertures......Page 295 6.10.1 Multiple Apertures......Page 298 6.10.2 Seams......Page 301 6.10.3 Transfer Impedance......Page 305 6.11 Waveguide Below Cutoff......Page 308 6.12 Conductive Gaskets......Page 310 6.12.1 Joints of Dissimilar Metals......Page 311 6.12.2 Mounting of Conductive Gaskets......Page 312 6.13 The "IDEAL" Shield......Page 315 6.14.1 Transparent Conductive Coatings......Page 316 6.15 Conductive Coatings......Page 317 6.15.3 Vacuum Metalizing......Page 319 6.15.5 Metal Foil Linings......Page 320 6.16 Internal Shields......Page 321 6.17 Cavity Resonance......Page 323 Summary......Page 324 Problems......Page 325 References......Page 327 Further Reading......Page 328 7.1 Glow Discharges......Page 330 7.2 Metal-Vapor or Arc Discharges......Page 331 7.3 AC Versus DC Circuits......Page 333 7.5 Contact Rating......Page 334 7.6 Loads with High Inrush Currents......Page 335 7.7 Inductive Loads......Page 336 7.8 Contact Protection Fundamentals......Page 338 7.9 Transient Suppression for Inductive Loads......Page 342 7.10.2 R–C Network......Page 346 7.10.3 R–C–D Network......Page 349 7.11 Inductive Loads Controlled by a Transistor Switch......Page 350 7.13 Contact Protection Selection Guide......Page 351 7.14 Examples......Page 352 Summary......Page 353 Problems......Page 354 Further Reading......Page 355 8.1 Thermal Noise......Page 356 8.2 Characteristics of Thermal Noise......Page 360 8.3 Equivalent Noise Bandwidth......Page 362 8.4 Shot Noise......Page 365 8.5 Contact Noise......Page 366 8.6 Popcorn Noise......Page 367 8.7 Addition of Noise Voltages......Page 368 8.8 Measuring Random Noise......Page 369 Summary......Page 370 Problems......Page 371 Further Reading......Page 373 9.1 Noise Factor......Page 374 9.2.1 Single-Frequency Method......Page 377 9.2.2 Noise Diode Method......Page 378 9.3 Calculating S/N Ratio and Input Noise Voltage from Noise Factor......Page 379 9.4 Noise Voltage and Current Model......Page 381 9.5 Measurment of V(n) and I(n)......Page 383 9.6 Calculating Noise Factor and S/N Ratio from V(n)–I(n)......Page 384 9.7 Optimum Source Resistance......Page 385 9.8 Noise Factor of Cascaded Stages......Page 388 9.9 Noise Temperature......Page 390 9.10 Bipolar Transistor Noise......Page 392 9.10.1 Transistor Noise Factor......Page 393 9.10.2 V(n)–I(n) for Transistors......Page 395 9.11.1 FET Noise Factor......Page 396 9.12 Noise in Operational Amplifiers......Page 398 9.12.1 Methods of Specifying Op-Amp Noise......Page 401 Summary......Page 403 Problems......Page 404 References......Page 405 Further Reading......Page 406 10. Digital Circuit Grounding......Page 407 10.3 Digital Logic Noise......Page 408 10.4 Internal Noise Sources......Page 409 10.5 Digital Circuit Ground Noise......Page 412 10.5.1 Minimizing Inductance......Page 413 10.5.2 Mutual Inductance......Page 414 10.5.3 Practical Digital Circuit Ground Systems......Page 416 10.5.4 Loop Area......Page 418 10.6 Ground Plane Current Distribution and Impedance......Page 419 10.6.1 Reference Plane Current Distribution......Page 420 10.6.2 Ground Plane Impedance......Page 428 10.6.3 Ground Plane Voltage......Page 436 10.6.4 End Effects......Page 437 10.7 Digital Logic Current Flow......Page 440 10.7.1 Microstrip Line......Page 442 10.7.2 Stripline......Page 443 10.7.3 Digital Circuit Current Flow Summary......Page 446 Summary......Page 447 Problems......Page 448 References......Page 449 Further Reading......Page 450 PART 2 EMC APPLICATIONS......Page 451 11.1 Power Supply Decoupling......Page 453 11.2 Transient Power Supply Currents......Page 454 11.2.1 Transient Load Current......Page 455 11.2.2 Dynamic Internal Current......Page 456 11.2.3 Fourier Spectrum of the Transient Current......Page 457 11.3 Decoupling Capacitors......Page 459 11.4 Effective Decoupling Strategies......Page 464 11.4.2 Multiple Capacitors of the Same Value......Page 465 11.4.3 Multiple Capacitors of Two Different Values......Page 468 11.4.4 Multiple Capacitors of Many Different Values......Page 472 11.4.5 Target Impedance......Page 473 11.4.6 Embedded PCB Capacitance......Page 475 11.4.7 Power Supply Isolation......Page 480 11.5 The Effect of Decoupling on Radiated Emissions......Page 482 11.6 Decoupling Capacitor Type and Value......Page 484 11.7 Decoupling Capacitor Placement and Mounting......Page 485 11.8 Bulk Decoupling Capacitors......Page 487 11.9 Power Entry Filters......Page 488 Problems......Page 489 Further Reading......Page 491 12. Digital Circuit Radiation......Page 492 12.1 Differential-Mode Radiation......Page 493 12.1.3 Fourier Series......Page 496 12.1.4 Radiated Emission Envelope......Page 498 12.2.1 Board Layout......Page 499 12.2.2 Canceling Loops......Page 502 12.2.3 Dithered Clocks......Page 503 12.3 Common-Mode Radiation......Page 505 12.4 Controlling Common-Mode Radiation......Page 508 12.4.1 Common-Mode Voltage......Page 509 12.4.2 Cable Filtering and Shielding......Page 510 12.4.3 Separate I/O Grounds......Page 513 Summary......Page 516 Problems......Page 517 References......Page 518 Further Reading......Page 519 13.1 Power Line Impedance......Page 520 13.1.1 Line Impedance Stabilization Network......Page 522 13.2 Switched-Mode Power Supplies......Page 523 13.2.1 Common-Mode Emissions......Page 526 13.2.2 Differential-Mode Emissions......Page 529 13.2.4 Rectifier Diode Noise......Page 537 13.3 Power-Line Filters......Page 539 13.3.2 Differential-Mode Filtering......Page 540 13.3.3 Leakage Inductance......Page 541 13.3.4 Filter Mounting......Page 544 13.3.5 Power Supplies with Integral Power-Line Filters......Page 547 13.3.6 High-Frequency Noise......Page 548 13.4 Primary-to-Secondary Common-Mode Coupling......Page 551 13.6 Power Supply Instability......Page 552 13.7 Magnetic Field Emissions......Page 553 13.8 Variable Speed Motor Drives......Page 556 13.9 Harmonic Suppression......Page 564 13.9.2 Active Power Factor Correction......Page 566 13.9.3 AC Line Reactors......Page 567 Summary......Page 569 Problems......Page 570 Further Reading......Page 572 14.1 Performance Criteria......Page 573 14.2 RF Immunity......Page 574 14.2.1 The RF Environment......Page 575 14.2.2 Audio Rectification......Page 576 14.2.3 RFI Mitigation Techniques......Page 577 14.3 Transient Immunity......Page 585 14.3.2 Electrical Fast Transient......Page 586 14.3.3 Lightning Surge......Page 587 14.3.4 Transient Suppression Networks......Page 588 14.3.5 Signal Line Suppression......Page 589 14.3.6 Protection of High-Speed Signal Lines......Page 592 14.3.7 Power Line Transient Suppression......Page 594 14.3.8 Hybrid Protection Network......Page 598 14.4 Power Line Disturbances......Page 600 14.4.1 Power Line Immunity Curve......Page 601 Summary......Page 603 Problems......Page 604 References......Page 606 Further Reading......Page 607 15.1 Static Generation......Page 608 15.1.1 Inductive Charging......Page 611 15.1.2 Energy Storage......Page 613 15.2 Human Body Model......Page 615 15.3 Static Discharge......Page 617 15.3.1 Decay Time......Page 618 15.4 ESD Protection in Equipment Design......Page 620 15.5 Preventing ESD Entry......Page 622 15.5.1 Metallic Enclosures......Page 623 15.5.2 Input/Output Cable Treatment......Page 627 15.5.3 Insulated Enclosures......Page 632 15.5.4 Keyboards and Control Panels......Page 635 15.7 ESD Grounding......Page 636 15.8 Nongrounded Products......Page 637 15.9 Field-Induced Upset......Page 638 15.9.2 Capacitive Coupling......Page 639 15.10 Transient Hardened Software Design......Page 640 15.10.1 Detecting Errors in Program Flow......Page 641 15.10.2 Detecting Errors in Input/Output......Page 642 15.10.3 Detecting Errors in Memory......Page 644 Summary......Page 645 Problems......Page 647 References......Page 648 Further Reading......Page 649 16.1.2 Keep Out Zones......Page 650 16.1.3 Critical Signals......Page 651 16.1.4 System Clocks......Page 652 16.2 PCB-to-Chassis Ground Connection......Page 653 16.3 Return Path Discontinuities......Page 654 16.3.1 Slots in Ground/Power Planes......Page 655 16.3.2 Split Ground/Power Planes......Page 656 16.3.3 Changing Reference Planes......Page 658 16.3.4 Referencing the Top and Bottom of the Same Plane......Page 661 16.3.6 Ground Fill......Page 662 16.4 PCB Layer Stackup......Page 663 16.4.1 One- and Two-Layer Boards......Page 664 16.4.2 Multilayer Boards......Page 665 16.4.3 General PCB Design Procedure......Page 681 Summary......Page 683 Problems......Page 685 Further Reading......Page 686 17.1 Split Ground Planes......Page 688 17.2 Microstrip Ground Plane Current Distribution......Page 690 17.3 Analog and Digital Ground Pins......Page 693 17.4 When Should Split Ground Planes Be Used?......Page 696 17.5 Mixed Signal ICs......Page 697 17.6 High-Resolution A/D and D/A Converters......Page 699 17.6.1 Stripline......Page 701 17.6.2 Asymmetric Stripline......Page 702 17.6.3 Isolated Analog and Digital Ground Planes......Page 703 17.7.1 Sampling Clocks......Page 704 17.7.2 Mixed-Signal Support Circuitry......Page 706 17.8 Vertical Isolation......Page 707 17.9.1 Power Distribution......Page 709 17.9.2 Decoupling......Page 710 17.10 The IPC Problem......Page 712 Summary......Page 713 Problems......Page 714 Further Reading......Page 715 18. Precompliance EMC Measurements......Page 716 18.2 Antennas Versus Probes......Page 717 18.3 Common-Mode Currents on Cables......Page 718 18.3.2 Cautions......Page 721 18.4 Near Field Measurements......Page 722 18.4.1 Test Procedure......Page 723 18.4.2 Cautions......Page 724 18.5 Noise Voltage Measurements......Page 725 18.5.1 Balanced Differential Probe......Page 726 18.6 Conducted Emission Testing......Page 728 18.6.1 Test Procedure......Page 730 18.6.2 Cautions......Page 731 18.6.3 Separating C-M from D-M Noise......Page 732 18.7 Spectrum Analyzers......Page 735 18.7.1 Detector Functions......Page 737 18.7.2 General Test Procedure......Page 738 18.8 EMC Crash Cart......Page 739 18.8.1 Mitigation Parts List......Page 740 18.9.2 Limits for 1-m Testing......Page 741 18.9.3 Antennas for 1-m Testing......Page 742 18.10.1 Radiated Immunity......Page 745 18.10.2 Conducted Immunity......Page 748 18.10.3 Transient Immunity......Page 749 18.11 Precompliance Power Quality Tests......Page 751 18.11.1 Harmonics......Page 752 18.11.2 Flicker......Page 753 18.12.1 Radiated Emission Margin......Page 754 18.12.2 Electrostatic Discharge Margin......Page 755 Summary......Page 756 Problems......Page 757 References......Page 758 Further Reading......Page 759 A.1 Properties of Logarithms......Page 761 A.2 Using the Decibel for Other than Power Measurements......Page 762 A.4 Absolute Power Level......Page 764 A.5 Summing Powers Expressed in Decibels......Page 766 B. The Ten Best Ways to Maximize the Emission from Your Product......Page 768 C. Multiple Reflections of Magnetic Fields in Thin Shields......Page 771 D.1 Basic Dipoles for Dummies......Page 774 D.2 Intermediate Dipoles for Dummies......Page 779 D.3.2 Dipole Resonance......Page 784 D.3.4 Theory of Images......Page 787 D.3.5 Dipole Arrays......Page 789 Summary......Page 791 Further Reading......Page 792 E.1 Inductance......Page 793 E.2 Loop Inductance......Page 795 E.2.1 Inductance of a Rectangular Loop......Page 796 E.3 Partial Inductance......Page 798 E.3.1 Partial Self-Inductance......Page 799 E.3.2 Partial Mutual Inductance......Page 801 E.3.4 Partial Inductance Applications......Page 804 E.3.5 Transmission Line Example......Page 806 E.4 Ground Plane Inductance Measurement Test Setup......Page 808 E.5 Inductance Notation......Page 813 References......Page 816 Further Reading......Page 817 F. Answers to Problems......Page 818 Index......Page 853

praise For Noise Reduction Techniques In Electronic Systems

henry Ott Has Literally 'written The Book' On The Subject Of Emc. . . . He Not Only Knows The Subject, But Has The Rare Ability To Communicate That Knowledge To Others.

—ee Times

electromagnetic Compatibility Engineering Is A Completely Revised, Expanded, And Updated Version Of Henry Ott's Popular Book Noise Reduction Techniques In Electronic Systems. It Reflects The Most Recent Developments In The Field Of Electromagnetic Compatibility (emc) And Noise Reduction'and Their Practical Applications To The Design Of Analog And Digital Circuits In Computer, Home Entertainment, Medical, Telecom, Industrial Process Control, And Automotive Equipment, As Well As Military And Aerospace Systems.

while Maintaining And Updating The Core Information—such As Cabling, Grounding, Filtering, Shielding, Digital Circuit Grounding And Layout, And Esd—that Made The Previous Book Such A Wide Success, This New Book Includes Additional Coverage Of:

• equipment/systems Grounding
• switching Power Supplies And Variable-speed Motor Drives
• digital Circuit Power Distribution And Decoupling
• pcb Layout And Stack-up
• mixed-signal Pcb Layout
• rf And Transient Immunity
• power Line Disturbances
• precompliance Emc Measurements
• new Appendices On Dipole Antennae, The Theory Of Partial Inductance, And The Ten Most Common Emc Problems

the Concepts Presented Are Applicable To Analog And Digital Circuits Operating From Below Audio Frequencies To Those In The Ghz Range. Throughout The Book, An Emphasis Is Placed On Cost-effective Emc Designs, With The Amount And Complexity Of Mathematics Kept To The Strictest Minimum.

complemented With Over 250 Problems With Answers, Electromagnetic Compatibility Engineering Equips Readers With The Knowledge Needed To Design Electronic Equipment That Is Compatible With The Electromagnetic Environment And Compliant With National And International Emc Regulations. It Is An Essential Resource For Practicing Engineers Who Face Emc And Regulatory Compliance Issues And An Ideal Textbook For Ee Courses At The Advanced Undergraduate And Graduate Levels.

Praise for Noise Reduction Techniques IN electronic systems'Henry Ott has literally'written the book'on the subject of EMC.... He not only knows the subject, but has the rare ability to communicate that knowledge to others.'—EE Times Electromagnetic Compatibility Engineering is a completely revised, expanded, and updated version of Henry Ott's popular book Noise Reduction Techniques in Electronic Systems. It reflects the most recent developments in the field of electromagnetic compatibility (EMC) and noise reduction¿and their practical applications to the design of analog and digital circuits in computer, home entertainment, medical, telecom, industrial process control, and automotive equipment, as well as military and aerospace systems. While maintaining and updating the core information—such as cabling, grounding, filtering, shielding, digital circuit grounding and layout, and ESD—that made the previous book such a wide success, this new book includes additional coverage of: Equipment/systems grounding Switching power supplies and variable-speed motor drives Digital circuit power distribution and decoupling PCB layout and stack-up Mixed-signal PCB layout RF and transient immunity Power line disturbances Precompliance EMC measurements New appendices on dipole antennae, the theory of partial inductance, and the ten most common EMC problems The concepts presented are applicable to analog and digital circuits operating from below audio frequencies to those in the GHz range. Throughout the book, an emphasis is placed on cost-effective EMC designs, with the amount and complexity of mathematics kept to the strictest minimum. Complemented with over 250 problems with answers, Electromagnetic Compatibility Engineering equips readers with the knowledge needed to design electronic equipment that is compatible with the electromagnetic environment and compliant with national and international EMC regulations. It is an essential resource for practicing engineers who face EMC and regulatory compliance issues and an ideal textbook for EE courses at the advanced undergraduate and graduate levels. Praise for Noise Reduction Techniques IN electronic systems ""Henry Ott has literally 'written the book' on the subject of EMC. . . . He not only knows the subject, but has the rare ability to communicate that knowledge to others.""-EE Times Electromagnetic Compatibility Engineering is a completely revised, expanded, and updated version of Henry Ott's popular book Noise Reduction Techniques in Electronic Systems. It reflects the most recent developments in the field of electromagnetic compatibility (EMC) and noise reduction¿and their practical applications t "Electromagnetic Compatibility Engineering is a completely revised, expanded, and updated version of Henry Ott's popular book Noise Reduction Techniques in Electronic Systems. It reflects the most recent developments in the field of electromagnetic compatibility (EMC) and noise reduction?and their practical applications to the design of analog and digital circuits in computer, home entertainment, medical, telecom, industrial process control, and automotive equipment, as well as military and aerospace systems."--Résumé de l'éditeur