Chemical Mechanical Polishing in Silicon Processing, Volume 63 (Semiconductors and Semimetals)

Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded. Reflecting the truly interdisciplinary nature of the field that the series covers, the volumes in Semiconductors and Semimetals have been and will continue to be of great interest to physicists, chemists, materials scientists, and device engineers in modern industry. Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded. Reflecting the truly interdisciplinary nature of the field that the series covers, the volumes in Semiconductors and Semimetals have been and will continue to be of great interest to physicists, chemists, materials scientists, and device engineers in modern industry Content: Edited by Pages ii-iii Copyright page Page iv Preface Pages xi-xiii Shin Hwa Li, Robert O. Miller List of Contributors Page xv Chapter 1 Introduction Original Research Article Pages 1-4 Frank B. Kaufman Chapter 2 Equipment Original Research Article Pages 5-45 Thomas Bibby, Karey Holland Chapter 3 Facilitization Original Research Article Pages 47-87 John P. Bare Chapter 4 Modeling and Simulation Original Research Article Pages 89-137 Duane S. Boning, Okumu Ouma Chapter 5 Consumables I: Slurry Original Research Article Pages 139-153 Shin Hwa Li, Bruce Tredinnick, Mel Hoffman Chapter 6 CMP Consumables II: Pad Original Research Article Pages 155-181 Lee M. Cook Chapter 7 Post-CMP Clean Original Research Article Pages 183-214 François Tardif Chapter 8 CMP Metrology Original Research Article Pages 215-244 Shin Hwa Li, Tara Chhatpar, Frederic Robert Chapter 9 Applications and CMP-Related Process Problems Original Research Article Pages 245-281 Shin Hwa Li, Visun Bucha, Kyle Wooldridge Index Pages 283-287 Contents of Volumes in this Series Pages 289-307 Chemical mechanical planarization (CMP) has become, in a few short years, a required semiconductor processing module used in fabrication facilities worldwide.