Advances in Electronic Circuit Packaging : Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, Sponsored by the University of Colorado and EDN (Electrical Design News), Held at Boulder, Colorado

The Proceedings of The Second Electronic Circuit Packaging Symposium provides diverse examinations of an ever-growing problem-the assembly of electrical circuitry so that the final product fulfills its intended mission. Although approaches and techniques differ, the goal is the same: combine components into a package that will pass size, environmental, appearance, and/or economic "tests. " Subjects treated in this "Proceedings" range from large, rack-type units packaged for use in Polaris-firing submarines to microminiaturized, solidcircuit semiconductor networks. They vary from the shock and acceleration problems of landing operating instrumentation on the moon to the temperature and pressure problems of oil-well logging instruments lowered several miles below the earth. And yet, universal approaches to improved materials, interconnections, and component placement are significant extensions of the stateof-the art of all electronic packaging. This volume, therefore, is a collection of varying means to a common goal. It is written by mechanical, electrical, and electronic engineers along with physiCists, chemists, and mathematicians, but it is directed to the newest of all designers, the electronic circuit packaging engineer. It should be noted that in some cases, the discussion period is even more fruitful and revealing than the paper itself. This is due in part to the advance distribution of each paper. During the meeting, the authors highlighted their presentations with slides and points of special interest. This procedure eliminated the need for verbatim reading of the papers and resulted in the lively discussions included with each paper. Of course, the success of the second Symposium must be attributed to the speakers and to those who attended. Their comments and evaluations have clearly indicated a need for such conferences. Plans are now being made for the third Symposium and your interest in packaging can be manifested in your participation-either as a speaker or as an attendee -at future Symposia. Front Matter....Pages i-xv Materials for Electronic Packaging....Pages 1-20 Controlling the Mechanical Response of Printed Circuit Boards....Pages 21-34 A Low-Density Potting Compound....Pages 35-51 An Effective Use of Castings in a Lightweight Electronic Package....Pages 52-60 Heat Sinks and Encapsulants for Volumetric Packaging....Pages 61-76 Potting Problems Related to Packaging Design....Pages 77-90 Packaging of Semiconductor Networks....Pages 91-103 Thermal Packaging for Transient Operation....Pages 104-120 Formulation and Solution of Circuit Card Design Problems through Use of Graph Methods....Pages 121-142 Maintainable Electronic Component Assemblies....Pages 143-165 Electronic Packaging for 5000 g Survival....Pages 166-180 Packaging of a Telemeter to Withstand Impulse Accelerations of 500,000 g ....Pages 181-202 The Welded-Wire Matrix—An Important Step Beyond Printed Wiring....Pages 203-212 Weld Improvement Study Indicating Future Electronics Packaging Applications....Pages 213-218 Automatic Packaging of Miniaturized Circuits....Pages 219-232 Illogical Packaging Design....Pages 233-238 Radiation-Effects Considerations in the Design of Electronic Circuit Packaging for Nuclear-Powered Vehicles....Pages 239-253 Electronic Packaging for Oil-Well Logging....Pages 254-263 Instrumentation Equipment for Polaris Firing Submarines Installed in a Unique Modular Design....Pages 264-278 Miniaturized Positioners for Modular Packaging....Pages 279-288 Development of Miniature and Microminiaturized Electronic Packages....Pages 289-298 The Hidden Value—Packaging for Appearance....Pages 299-308 Cruciform Packaging—A General Synthesis for Airborne Electronics....Pages 309-320 The Systems Approach to Electronic Packaging....Pages 321-328